-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueComing to Terms With AI
In this issue, we examine the profound effect artificial intelligence and machine learning are having on manufacturing and business processes. We follow technology, innovation, and money as automation becomes the new key indicator of growth in our industry.
Box Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
SolderStar Joins Industry Experts at Seminar to Address Profiling Techniques
November 30, 2015 | SolderStarEstimated reading time: 2 minutes
SolderStar joined industry experts from the electronics manufacturing sector to address the issues surrounding thermal profiling for today’s highly complex assemblies and discuss the way this impacts the manner in which the industry measures component temperatures accurately.
The one-day event held at The Manufacturing Technology Centre in Coventry, UK gave attendees the opportunity to learn new methods and understand issues surrounding profiling techniques, including attachment method best practice, process setup and profile optimisation scenarios for lower energy use or higher throughputs.
SolderStar a leading specialist manufacturer in the design and development of thermal profiling equipment for the lead-free electronics industry, concentrated their thoughts on the reflow process control, the need for the practice, and how modern technologies and processes lead to 100% traceability.
Keith Blakeley, SolderStar Product Manager said: “The seminar was a great opportunity to meet the engineers who work in the electronics manufacturing and design sector.
“We concentrated our presentation on why we need to actively control processes used in manufacturing and the factors driving this need. Producing electronic assemblies without a known thermal profile is detrimental. Without an established oven profile, problems can occur with soldering quality, cleaning issues or further down the line involving either rework costs or early component failures, a major cost in today’s increased manufacture of micro-assemblies. A poor thermal profile can be one of the main factors contributing to manufacturing defects within reflow soldering.
Page 1 of 2
Suggested Items
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
05/17/2024 | Andy Shaughnessy, Design007 MagazineThis week, trade shows are at the top of our feed, with our coverage of the Del Mar Electronics and Manufacturing Show and IPC APEX EXPO. These two longtime events are almost polar opposites in size and scope, but Del Mar seems to be expanding from its roots as a “neighborhood gathering” with its move into the Del Mar Fairgrounds. The Del Mar show always has a good “buzz factor,” which is something you can’t buy.
Real Time with… IPC APEX EXPO 2024: Insulectro on Attracting Young Talent to the Electronics Manufacturing Industry
05/16/2024 | Real Time with...IPC APEX EXPOInsulectro's Doug Gotelli and Mitchell Benson explore the challenges of drawing young talent into the electronics manufacturing industry. They underscore the significance of manufacturing and the urgency of tackling the workforce shortage. They also discuss internship programs, the industry's resilience amid the pandemic, and the rewarding experiences of working in this sector.
Siemens, Foxconn Team Up to Optimize Forward-thinking Manufacturing
05/16/2024 | FoxconnSiemens AG, a leading technology company, and Hon Hai Technology Group (Foxconn), the world’s largest electronics manufacturer, have signed a memorandum of understanding (MoU) to drive digital transformation and sustainability in smart manufacturing platforms.
TRI Opens New Manufacturing Facility
05/16/2024 | TRITest Research, Inc. (TRI), the leading test and inspection systems provider for the electronics manufacturing industry, announced that it has opened a state-of-the-art R&D and manufacturing facility.
SEMICON West 2024 to Spotlight U.S. Chip Industry Investments, Supply Chain Resilience, Talent, and Global Growth and Innovation
05/15/2024 | SEMISEMICON West 2024 will gather industry experts and leaders July 9-11 at the Moscone Center in San Francisco for insights into the latest trends and innovations in sustainability, supply chain management, workforce development and other critical industry issues.