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Alpha Talks Challenges of Solder Recycling
December 22, 2015 | Patty Goldman, I-Connect007Estimated reading time: 13 minutes
Fullerton: I joke that it's the evil that we know versus the evil we don't know. We have a very good handle on the life cycle of tin-lead solder based on research and historical usage. We have not even 10 years doing lead-free. We still don't have that 30, 40, 50-year life cycle product that has actually been in the field long enough to see how those react.
Goldman: Like those airplanes.
Fullerton: Right, exactly. Those segments still stay with tin-lead because they can quantify the reliability and they can plan around that. With the lead-frees, the long, long term reliability still hasn't been proven out, pro or con. Those industries are afraid of the unknown. They'd rather quantify it and plan around it, so that's where they still live.
Goldman: When you need the ultimate reliability, you stick with what you know that has the reliability.
Fullerton: Yep, I want the airplane that takes me home to Philadelphia tomorrow to have the most reliable solder possible.
Goldman: And I don't care about anything else.
Fullerton: Exactly.
Goldman: Wonderful. Well, thanks for stopping by Jason.
Fullerton: No problem. Thanks for having me.
Page 3 of 3Suggested Items
Indium Experts to Present on High-Temperature, Lead-Free Solder Paste and High Reliability Liquid Metal Alloys Poster at ECTC
05/16/2024 | Indium CorporationIndium Corporation Research Associate Kyle Aserian will deliver a presentation at the 74th Electronic Components and Technology Conference (ECTC) on May 31, in Denver, Colorado.
Indium Experts to Present at Electronics in Harsh Environments SMTA Conference
05/13/2024 | Indium Corporationndium Corporation Technical Manager for Europe, Africa, and the Middle East, Karthik Vijay, will deliver a technical presentation and Indium Corporation Senior Technologist, Dr. Ronald Lasky, will deliver both a workshop and technical presentation at the Electronics in Harsh Environments SMTA Conference on May 14-16 in Copenhagen, Denmark.
Connect the Dots: Designing for Reality—The Pre-Manufacturing Process
05/08/2024 | Matt Stevenson -- Column: Connect the DotsI have been working with Nolan Johnson on a podcast series about designing PCBs for the reality of manufacturing. By sharing lessons learned over a long career in the PCB industry, we hope to shorten learning curves and help designers produce better boards with less hassle and rework. Episode 2 deals with the electronic pre-manufacturing process. Moving from CAD (computer-aided design) to CAM (computer-aided manufacturing) is a key step in PCB manufacturing. CAM turns digital designs into instructions that machines can use to actually build the PCB.
AIM Solder Signs Shinil Fl Ltd. as New Distributor for Korea
05/08/2024 | AIM SolderAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce a new distribution partnership with Shinil Fl Ltd., a prominent supplier of technological solutions in the SMT and semiconductor sectors.
Indium Corporation to Showcase HIA Materials at ECTC
05/07/2024 | Indium CorporationAs an industry leader in innovative materials solutions for semiconductor packaging and assembly, Indium Corporation® will feature its advanced products designed to meet the evolving challenges of heterogeneous integration and assembly (HIA) and fine-pitch system-in-package (SiP) applications at the 74th Electronic Components and Technology Conference (ECTC), May 28‒31, in Denver, Colorado.