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Indium Corporation’s Andreas Karch, Regional Technical Manager for Germany, Austria and Switzerland, was recognized for his technical presentation at the IMAPS Autumn Conference in October in Munich, Germany.
Karch was awarded “Best Presentation” for the session New Solder Material Technology in the Manufacturing Process of IGBT Modules, which discussed a new method that produces strong, reliable solder joints that resist cracking and thermal fatigue.
Karch provides support, including sharing process knowledge and making technical recommendations for the use of Indium Corporation’s materials, including solder paste, solder preforms, fluxes, and thermal management materials. Karch has more than 20 years of automotive industry experience, including the advanced development of customized electronics. He is an ECQA-certified integrated design engineer and has a Six Sigma Yellow Belt. The Austrian Patent Office also selected him as one of the 2014 recipients of the Top 10 Inventum Awards for an automotive LED assembly. Karch maintains a thorough understanding of process technologies and project management skills.
IMAPS is a global community of microelectronic related engineers, scientists, manufacturers, end-users, and supply chain companies. The Society aims to support the development and growth of the microelectronics and related industries, and to aid the transfer of knowledge and information.
About Indium Corporation
Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.