Cogiscan Co-NECTs Machines, Software and Enterprise Systems at IPC APEX EXPO 2017


Reading time ( words)

Cogiscan Inc. will introduce its new Co-NECT Production Software in Booth 3132 at the 2017 IPC APEX EXPO, scheduled to take place February 14-16, 2017 at the San Diego Convention Center in California. Cogiscan's Co-NECT is a unique, standalone and neutral connectivity solution that addresses the greatest challenge in the industry at this point: Connectivity between different machines, software and enterprise systems. This technology enables Industry 4.0 for electronics assembly.

Co-NECT supports all existing and future industry standards such as SECS/GEM, CAMX, ZVEI, JSON, as well as proprietary interfaces from leading MES and machines vendors. The Cogiscan Co-NECT connectivity layer enables data exchange in real-time in very large manufacturing sites with hundreds of machines. The architecture and supporting infrastructure is optimized to ensure that there are no delays or any lag in response time, regardless of how many lines / machines / workstations are connected.

Co-NECT is built upon the standard Cogiscan TTC platform that has been around for more than 15 years. It adapts to every customers' environment, regardless of the mix of machines and software solutions already in place. The use of a third-party connectivity middleware means that each customer can keep their options open for the future instead of limiting themselves to a single vendor solution.

About Cogiscan Inc.

Cogiscan is the leading track, trace and control (TTC) solutions provider for the electronics manufacturing industry.   The scalable Cogiscan platform perfectly integrates with all major equipment types, and is highly configurable to enable a personalized solution to each customer’s specific production needs.  Since 1999 Cogiscan has attained several international patents for TTC hardware and software, and has won multiple awards throughout the years. For more information, click here.

Share

Print


Suggested Items

Smart Is Not A Binary Concept

04/21/2021 | Michael Ford, Aegis Software
“Smart” is not simply an “on” or “off” state. Just like people, some solutions are “smarter” than others; as we see from the various ways of measuring intelligence within humans, there are many kinds of “smarts.” When looking to invest in a smart manufacturing strategy, the playing field is more complex than it may appear. We should first understand and define what “smart” means, to what extent it exists, and the other requirements and dependencies that are needed to get the best value from investment.

A New Captive PCB Facility in the U.S.

04/19/2021 | I-Connect007 Editorial Team
Diane Maceri and Jessi Hall discuss how Schweitzer Engineering Laboratories (SEL) has been working with Alex Stepinski of GreenSource Fabrication to build their own captive PCB facility in Moscow, Idaho; the thought process behind that decision; and their involvement in the Managers Forum at IPC APEX EXPO 2021.

Excerpt—The Printed Circuit Assembler’s Guide to... SMT Inspection: Today, Tomorrow, and Beyond, Chapter 2

04/15/2021 | Brent Fischthal, Koh Young America
A limitation of many 3D optical inspection systems is the cycle time typically associated with processing millions of pixels to reconstruct a full 3D image using data captured from multiple channels. There should not be a compromise between 3D inspection and throughput. A successful inspection deployment should provide oversight for the process, not compromise, interrupt or slow that process.



Copyright © 2021 I-Connect007. All rights reserved.