RoHS Exemptions Unlikely to Be Published Before Fall 2017


Reading time ( words)

The EU Commission and Member States continue to meet to discuss the disposition of RoHS exemption renewal requests submitted by industry in January 2015.  During their December 15, 2016 meeting in Brussels, the experts reviewed requests on: Lead as an alloying element in steel (Annex III exemption 6a); Lead as an alloying element in aluminum (Annex III exemption 6b); Lead as an alloying element in copper (Annex III exemption 6c); Lead in high melting temperature type solders (Annex III exemption 7a); Lead in a glass or ceramic other than dielectric ceramic in capacitors (Annex III exemption 7c-I), jointly with exemption request 2015-1; Lead as activator in the fluorescent powder (Annex III exemption 18b), jointly with exemption request 2015-3; Lead in solders for the soldering to machined through hole discoidal and planar array ceramic multilayer capacitors (Annex III exemption 24); and Lead in cermet-based trimmer potentiometer elements (Annex III exemption 34). 

The Commission is currently working on preparing the draft legislative proposals for these and other exemptions) which will be sent to Member States for written consultation.  The drafts will likely be published in the spring; final legislative acts could be published in the Official Journal of the EU (OJEU) in the fall at the earliest. Under the EU RoHS2, all existing exemptions were set to expire by July 21, 2016. However, all exemptions for which industry submitted a renewal application will not expire until the EU Commission completes the current ongoing review of the applications.

Share

Print


Suggested Items

SMTA Europe Solder Finish Webinar Addresses Defects Causes and Cures

12/14/2020 | Pete Starkey, I-Connect007
“What is your most common PCB problem?” A survey conducted by Bob Willis had revealed finish solderability to be the predominant contender, and it was clear that the choice of solderable finish applied to surface mount boards could have a significant effect on the assembly yield and cost of the final circuit. SMTA Europe organised an informative and enlightening webinar this month entitled “Guide to PCB Solder Finishes—Process Defects Causes and Cures,” with soldering specialist Bob Willis as presenter.

Reducing Flux Splatter in Sensors and Camera Modules

10/30/2020 | Jasbir Bath, Shantanu Joshi, and Noriyoshi Uchida, Koki Solder America And Koki Company Limited
With the increased use of electronics in new technology areas, flux formulations are being developed to address the new and existing requirements. For sensors and camera modules used for Advanced Driver Assistance System (ADAS) and internet of things (IoT) applications, there is a demand for no-clean flux formulations in lead-free solder paste, which can reduce flux splattering during reflow.

How to Benefit From Robotic Soldering Processes

10/28/2020 | Pete Starkey, I-Connect007
Webinars are in vogue! But in Pete Starkey's experience, the master of the technical webinar with many years’ experience of delivering first-rate events is Bob Willis—electronics assembly specialist, soldering expert, and provider of training and consultancy in electronics manufacture. Here, Pete recaps Bob’s presentation on the upcoming robotic soldering experience.



Copyright © 2021 I-Connect007. All rights reserved.