IWLPC Technical Committee Announces Best Presentation & Papers Awards for 2016


Reading time ( words)

The IWLPC Technical Committee is pleased to announce the Best of Conference, Best Presentation & Best Papers in WLP, 3D, MEMS and Manufacturing  tracks  as chosen by the technical committee and attendees based on technical merit, relevance, originality, knowledge of subject, quality of material, and quality of presentation. 

 

Best of Conference Presentation - Paul Silvestri, Amkor Technology 

“3D-TSV Assembly: Package Architectures and Trade-offs” 

 

Best of Conference Paper - Allan Hilton, RTI International 

“Wafer-Level Vacuum Packaging of Microbolometer-based Infrared Imagers” 

 

Best of 3D Track Paper - Min Tao, Ph.D. Invensas 

“BVA Enabled Low-Profile, High-Density Fan-Out Wafer-Level PoP” 

 

Best of WLP Track Paper - Stream Chung, Chemleader 

“Electroplated Nano Twinned Copper for Wafer-Level Package” 

 

Best of MEMS Track Paper - Allan Hilton, RTI International 

“Wafer-Level Vacuum Packaging of Microbolometer-based Infared Imagers” 

 

Best of Manufacturing Track Paper - Gerard John, Amkor Technology 

“A Practical Approach to Test Through-Silicon Vias (TSV)” 

 

About IWLPC 

IWLPC brings together the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV and integrated system packaging.  

Going into its 14th year, the IWLPC is co-produced by Chip Scale Review, the leading international magazine addressing the semiconductor packaging industry, and SMTA, the distinguished global association representing electronic assembly and manufacturing professionals. 

The conference comprises three parallel technical tracks with two full days of presentations on wafer-level packaging, 3D integration, and MEMS development. Workshops, keynote speakers, and panel discussions are offered by world-class experts and enable attendees to broaden their technical knowledge. The technical program includes a two-day expo where 60+ exhibitors showcase their latest technologies and products. The conference provides a collective network of over 800 industry professionals, including vendors from leading semiconductor companies, foundries, and OSATS, as well as key technology, equipment, and materials suppliers in the exhibit area. Attendees will be inspired by the quantity and quality of the featured new developments and emerging technologies. The 14th Annual Conference will be held October 24-26, 2017 in San Jose, CA.   For more information click here.

Share

Print


Suggested Items

Critical Process Issues

02/06/2019 | Stephen Las Marias, I-Connect007
In our recent I-Connect007 survey, we asked what the top three critical issues are in the production process. Below are just a few of the replies, slightly edited for clarity.

Most Important Attributes of Customer Service

01/23/2019 | I-Connect007 Research Team
In a recent I-Connect007 survey, we asked what the most important attributes of customer service are. Understanding and meeting the customer's needs and expectations top the list, followed by quality of service, and on-time delivery.

West Penn SMTA: New Leadership, Same Commitment

06/28/2018 | Patty Goldman, I-Connect007
SMTA's new chapter president, Jason Emes, a quality engineer with Pennatronics Corporation enthusiastically discussed with I-Connect007's Patty Goldman the latest goings-on with this Keystone State chapter. He also spoke about his plans and initiatives for the SMTA West Penn Chapter.



Copyright © 2019 I-Connect007. All rights reserved.