AIM Appoints MTM-NE Metalle as Distributor of Full Line of Solder Products in Germany


Reading time ( words)

AIM Solder is pleased to announce the addition of MTM-NE Metalle as a new distributor for its full line of solder products in Germany. MTM-NE Metalle will stock and supply AIM solder paste, liquid flux, bar, wire as well as other solder assembly materials and will provide assistance to AIM customers within Germany.

MTM-NE Metalle specializes in the EMS industry and is a leading supplier of solders and lead-free products for the electronics industry. MTM employees have many years of experience in the metal, electronics, automotive and recycling sectors, offering companies in the EMS industry a unique blend of knowledge and experience. MTM is both a trading partner and service provider, offering customers technical support, training and services of solder analysis and waste management.

"We are pleased to partner with MTM.  The expertise that MTM brings will be an important addition to AIM's existing distributor network and direct sales efforts in this very important region," said David Suraski, AIM's Executive Vice President, Assembly Materials Division.

For more information about MTM-NE Metalle, please click here

For more information on AIM Solder’s complete line of advanced solder products and global technical services, please click here

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training.

Share

Print


Suggested Items

Advancement of SPI Tools to Support Industry 4.0 and Package Scaling

08/06/2019 | A. Prasad, L. Pymento, S.R. Aravamudhan, and C. Periasamy, Intel Corp.
This paper evaluates the current state of inline SPI tools from multiple vendors for solder paste measurement accuracy and capability. It discusses a measurement capability analysis that was carried out against a golden metrology tool across a range of volume deposits, and highlights the results from the study.

Practical Implementation of Assembly Processes for Low Melting Point Solder Pastes (Part 2)

07/24/2019 | Adam Murling, Miloš Lazić, and Don Wood, Indium Corporation; and Martin Anselm, Rochester Institute of Technology
In the last three to five years, there has been a resurgence of interest in the use of low melting point alloys for SMT applications. Typically, the compositions are around the eutectic bismuth-tin alloy, perhaps with additions of other elements to increase the robustness of certain alloy properties. Now, there are several new products on the market and numerous ongoing reliability projects in industry consortia.

The Four Things You Need to Know About Test

07/24/2019 | Neil Sharp, JJS Manufacturing
The electronics manufacturing process can often be extremely complex, and the costs associated with product recalls can be astronomical. A robust approach to test is key to ensuring the quality of your product and the satisfaction of your end user.



Copyright © 2019 I-Connect007. All rights reserved.