Goepel Unveils New Standard in Embedded Test and Programming


Reading time ( words)

goepel.jpgGoepel electronic is bringing its Embedded JTAG and automotive test solutions for a world premiere to Embedded World 2017, which will be held from March 14–16, 2017, in Nuremberg, Germany. Goepel electronic will be in Hall 4, Booth 271.

basicCAN6153.STM is the new stress and trigger module for CAN FD. It is specifically designed for manipulating CAN/CAN FD communication, enabling accurate protocol tests. The functionality is available as an extended option for the Series 61 communication controllers. 

The so-called Embedded JTAG Solutions will also be officially introduced for the first time. GOEPEL electronic presents a philosophy that includes complete coverage of JTAG-based test and programming technologies: Embedded Board Test, Embedded Functional Test and Embedded Programming. These elements will provide the most valuable tools for the electronics test challenges of the future. 

Numerous tried-and-tested technologies complete the range of offerings from GOEPEL electronic, with solutions for nearly any problem in the development or production area. These consist of high-speed bit error rate test of interfaces such as USB 3.0, the qualitative testing of high-speed link cables and test and validation of various processors. 

Users from the automotive sector will find a wide range of communication controllers from Series 61. For infotainment test applications, the Video Dragon excels as a frame generator and frame grabber to test high-speed connections. Video sources, such as cameras in driving assistance systems, can easily be linked to a standard PC using EasyCON.

Share

Print


Suggested Items

The Four Things You Need to Know About Test

07/24/2019 | Neil Sharp, JJS Manufacturing
The electronics manufacturing process can often be extremely complex, and the costs associated with product recalls can be astronomical. A robust approach to test is key to ensuring the quality of your product and the satisfaction of your end user.

Approaches to Overcome Nodules and Scratches on Wire-Bondable Plating on PCBs

07/17/2019 | Young K. Song and Vanja Bukva, Teledyne Dalsa Inc., and Ryan Wong, FTG Circuits
Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wirebond pads when inspected under 20X magnification. This paper details if wire bonding could be successfully performed over nodules and scratches and if there was a dimensional threshold where wire bonding could be successful.

ICT or Flying Probe: Which Test Is Best for Your Assembly?

07/10/2019 | Russell Poppe, JJS Manufacturing
In-circuit test (ICT) and flying probe are two of the most popular types of automated test equipment (ATE) used in electronic printed circuit board assembly (PCBA).



Copyright © 2019 I-Connect007. All rights reserved.