RapidProto Assembly Announced at APEX 2017


Reading time ( words)

RapidProto , a Rapid Assembly offering, delivering one to three day production-quality assembly options to fast-track product to production.

“Getting the prototype turned in a few days allows our CM partners to win more production business. Whoever builds the prototype, has the upper-hand, or intimate knowledge to win the production.” noted Tammie Fish, Managing Owner.

Having the Rapid mindset is the key to RapidProto.  Utilizing the latest in equipment technology, high-level ERP system, technician-level assemblers, quality validated boards and parts are all critical components for a smooth build.  Remembering that the product is more than likely a “first spin” is what sets RapidProto   apart from production-mindset assemblers.  On a prototype, the engineer is interested in what works or what doesn’t, what fits or doesn’t fit, and if their testing is showing strange results, they need to know that they can count on certain things: good parts, quality assembly practices, and that the bare PCB was built to the exact specifications requested.  Ruling out bad parts, PCB fabrication errors and assembly errors, the engineer is left with fewer variables to chase.  With fewer variables, finalizing a design is much faster, saving time and money in iterations. 

The most critical piece, the printed circuit board, is supplied by DIVSYS International, and the laboratory verification that DIVSYS provides (that the board is made to the engineer’s specification) is an integral piece of the RapidProto recipe.  Engineers don’t have time to chase PCB fabrication “ghosts” when they are nailing down their design.  Removing further variables, RapidProto will utilize customer-supplied components, or purchase the components from reliable distribution, and assemble the boards in a production model. 

RapidProto understands that the designer is laser-focused on the development process, and any activity that is not in the critical path is a needless diversion. 

If you would like more information about this topic, please contact Tammie Fish at 317-975-2060 or email at sales@RapidProto.com

Share


Suggested Items

Configure to Order: Different by Design

01/09/2018 | Michael Ford, Aegis Software Corp.
When considering implementation of Industry 4.0 solutions, following the hype in the market, attention typically is focused on the need for communication between machines on the shop-floor. Knowing what is currently executing and the status of each process in the factory, as well as all the related resources and support operations, provides critical information for Industry 4.0 computerized management systems.

Step Stencil Technologies and Their Effect on the SMT Printing Process

12/21/2017 | Greg Smith and Bill Kunkle, BlueRing Stencils, and Tony Lentz, FCT Assembly
Components such as quad flat no lead (QFNs), land grid array (LGAs), micro ball grid array (micro BGAs), 0201s and even 01005s continue to push manufacturers to use thinner stencil foils to apply the correct volume of paste onto their boards, but larger components such as edge connectors still require larger paste volumes.

What Matters Most is Communication

12/04/2017 | Stephen Las Marias, I-Connect007
While there may be new techniques and strategies, technologies, equipment, tools, and materials to employ and utilize, there is always one thing that will ensure the manufacturing/ assembly success of your product: communication. Communication between the designer and the assembler will help improve the manufacturability and assembly of the final product—even before the board design gets fabricated.



Copyright © 2018 I-Connect007. All rights reserved.