RTW IPC APEX EXPO: Indium Discusses Industry Trends and Reliability Issues


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Aware that the assembly industry is increasingly concerned with mechanical reliability issues associated with voiding in solder joints, Indium Corp. has developed unique solder paste and solder preform technology, independently proven to significantly reduce voiding. Product Manager Chris Nash talks with I-Connect007 Technical Editor Pete Starkey about how they are helping customers address their reliability issues, and discusses the success of their "Avoid the Void" campaign.

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