Super Dry to Launch Floor Life Reset Cabinets at SMT Hybrid Packaging 2017

Reading time ( words)

Super Dry Totech, MSD handling specialist and global manufacturer of ultra low humidity drying and storage cabinets, introduces a new Floor Life Reset Cabinet for moisture sensitive devices, setting new standards in terms of flexibility and speed. The moisture management solution will be on display for the first time in May at SMT Hybrid Packaging 2017. Super Dry Totech will be in Booth 4-547.

Depending upon ambient humidity and temperature, components can be safely used only within a limited time period, as classified by the IPC/JEDEC J-Std- 033C. New and proven technologies can now safely reset component floor life using low temperatures and ultra-low humidity without requiring extensive time, but insufficient tracking and process control implementation can lead to haphazard component drying, particularly when multiple batches of different MSL level parts need to be accommodated.  

The new Floor Life Reset Cabinets from Super Dry Totech bring an increased level of process control and multiple batch management to operations that do not have tracking software  implemented.

The Reset cabinets can independently track the timing of four separate batches of components being reset at the same time. Two separate chambers, each with their own dry-unit and heater enable two different temperatures to be utilized in the same cabinet. Both compartments are insulated with 6mm walls.

Dehumidifying to less than 1% RH, both chambers have their own dry-unit and heater, so they can operate independently from each other. Low temperature Heat (40°C-60°C) is added to accelerate the drying time.

Each compartment features a 4" color display with countdown timers for MSL. Component batch ID and MSL level are entered directly at the cabinet, and standardized reset times are either automatically calculated and timed, or entered manually per internally developed procedures. The user simply selects the MSL level and Thickness. When the Floor life time has been reset, the user is notified, and the part is ready for use or for placing into a storage cabinet or Moisture Barrier bag (MBB). 

All data can be tracked & recorded over time through an Ethernet connection and integrated software helping manufacturers on the path to achieving their industry 4.0 goals. 

Super_Dry2.jpgAmong other systems on display on the SMT booth will be the company’s fully automated, robotically controlled, component handling and storage system, Dry Tower. Incorporating mature, proven MSD technology and wide ranging WMS-System integration capabilities, Dry Towers are capable of automatically managing tens of thousands of reels and trays and are totally modular for all mix and volume manufacturing scenarios.

Relevant information for processing components is data base managed, from robotic entry through storage or floor life reset, as well as retrieval and delivery of specified components for production from and to one, two or even ten or more different assembly locations. 

The Super Dry Totech team will be on hand to explain to visitors how low humidity desiccant cabinets not only safely store components, but can also remove moisture and reset component floor life, while providing oxidation prevention equivalent to nitrogen at a fraction of the cost.

For more information visit


Suggested Items

HDI Considerations: Interview with ACDi's Garret Maxson

11/10/2017 | Stephen Las Marias, I-Connect007
Garret Maxson, manager of engineering services at American Computer Development Inc. (ACDi), discusses the PCB assembly challenges when dealing with high-density interconnect (HDI) boards, parameters to consider, and strategies to help facilitate a smooth assembly process when using HDI boards.

Reliability of ENEPIG by Sequential Thermal Cycling and Aging

11/06/2017 | Reza Ghaffarian, Jet Propulsion Laboratory, California Institute of Technology
Electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish for PCBs has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This article presents the reliability of LGA component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.

Achieving the Perfect Solder Joint: The Many Perspectives on Soldering

10/30/2017 | Stephen Las Marias, I-Connect007
For this month's issue of SMT Magazine, we brought several experts together to discuss the many aspects of soldering, from solder paste, to automation, inspection, and the challenges in achieving the perfect solder joint. We also talked about the strategies and parameters to consider to ensure reliable, good solder joints.

Copyright © 2017 I-Connect007. All rights reserved.