Conecsus Presents SMT Metals Waste Recycling Solutions at SMTA Juarez


Reading time ( words)

Conecsus LLC will exhibit at the SMTA Juarez Expo & Tech Forum, which will be held on April 6, 2017 at the Hotel Real Inn Cd Juarez in Mexico.

Conecsus representatives will illustrate how the company processes wastes containing primarily tin, tin-zinc, lead, silver, gold, and copper, and converts them into usable metal products for sale into the global market. They will illustrate how Conecsus recycling technology benefits the SMT/electronics manufacturing industry, with new ways of dealing with metals—contaminated waste in an increasingly environmentally-conscious manufacturing world. Employing patented, advanced recycling technologies, Conecsus keeps its customers compliant with local, state, and federal regulations while decreasing their carbon footprint and reportable waste streams. Conecsus is a sophisticated "green" recycler and refiner of SMT solder/solder paste wastes and residues.

SMTA Mexico is the most important forum in the ESMT PCB Electronics Industry in Mexico. In its 7th year of events, SMTA Mexico reaffirms the SMTA’s commitment to bring together the expertise of users and suppliers to one place. Attendees gain access to a "High Level Technical Conference" and discover the latest technology in the industry.

About Conecsus

Founded in 1980, Conecsus, LLC is a sophisticated ‘green’ recycler and refiner of SMT solder/solder paste wastes and residues, as well as Tin, Tin-Zinc, Lead, Silver, Gold, and Copper from a variety of manufacturing industries. Located in Terrell, Texas, USA, Conecsus converts these wastes into usable metal products. Conecsus’ mission is to provide innovative and high-quality industrial byproducts management, metal recovery, and recycling options that provide world-class value and service to our customers, and display respect and stewardship toward the environment. For more information, visit www.conecsusllc.com

Share


Suggested Items

Reliability of ENEPIG by Sequential Thermal Cycling and Aging

11/06/2017 | Reza Ghaffarian, Jet Propulsion Laboratory, California Institute of Technology
Electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish for PCBs has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This article presents the reliability of LGA component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.

Achieving the Perfect Solder Joint: The Many Perspectives on Soldering

10/30/2017 | Stephen Las Marias, I-Connect007
For this month's issue of SMT Magazine, we brought several experts together to discuss the many aspects of soldering, from solder paste, to automation, inspection, and the challenges in achieving the perfect solder joint. We also talked about the strategies and parameters to consider to ensure reliable, good solder joints.

Is Hybrid Technology Gaining Momentum?

10/02/2017 | Dieter G. Weiss, Weiss Engineering
Over the past 20 years, ceramic hybrids have changed more and more to a backyard living in the European electronics industry, mainly driven by price pressure, specifically from the automotive electronics industry.



Copyright © 2017 I-Connect007. All rights reserved.