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Vexos' manufacturing facility in LaGrange, Ohio, is now certified under UL Certification ZPV12. With this UL certification, and its FDA registration, the facility can build the most complex or the simplest products, under the strict processes of its rigorous quality systems.
Markets requiring final assembly UL certification have an easier time receiving their certification when working with Vexos now that its facility has UL Certification ZPV12. This traceability certification ensures these products are built to exacting standards, with full traceability, and therefore do not need individual inspection post assembly. This seamless qualification process saves valuable time and money during final inspection because UL does not need to disassemble the product for testing.
"This UL Certification is just another example of the importance of health, safety, traceability and quality for our customers. We are proud of this team, the equipment, but especially the processes in place that provide superior products in the market," said John Wilkinson, SVP & GM of Vexos LaGrange.
Stephen Las Marias, I-Connect007
Paul Salerno, global portfolio manager for SMT assembly solutions at Alpha Assembly Solutions, discusses the growing automotive electronics industry, its impact on the soldering materials business, and how Alpha helps customers address the new challenges and requirements in the automotive market.
Michael Ford, Aegis Software Corp.
When considering implementation of Industry 4.0 solutions, following the hype in the market, attention typically is focused on the need for communication between machines on the shop-floor. Knowing what is currently executing and the status of each process in the factory, as well as all the related resources and support operations, provides critical information for Industry 4.0 computerized management systems.
Greg Smith and Bill Kunkle, BlueRing Stencils, and Tony Lentz, FCT Assembly
Components such as quad flat no lead (QFNs), land grid array (LGAs), micro ball grid array (micro BGAs), 0201s and even 01005s continue to push manufacturers to use thinner stencil foils to apply the correct volume of paste onto their boards, but larger components such as edge connectors still require larger paste volumes.