MIRTEC Europe to Exhibit at What’s New in Electronics Live Event


Reading time ( words)

MIRTEC today announced they are participating in the upcoming What’s New in Electronics Live! event. They will exhibit in booth #327. The show is scheduled for May 9-10 and will take place at the National Exhibition Center in Birmingham, UK. 

On display at the show, MIRTEC’s MV-6E OMNI, which is unquestionably the inspection industry’s most technologically advanced AOI system in consideration. The all new MV-6E OMNI 3D In-Line AOI system is configured with  MIRTEC’s exclusive OMNI-VISION®3D Inspection Technology which combines our award winning 15 Megapixel ISIS Vision System with MIRTEC’s revolutionary Digital Multi-Frequency Eight Projection 3D system to provide precision inspection of SMT devices on finished PCB assemblies. MIRTEC’s 15 Megapixel ISIS Vision System is a proprietary camera system designed and manufactured by MIRTEC for use with our complete product range of inspection equipment.  MIRTEC’s Digital Multi-Frequency Eight Projection Technology provides true 3D inspection using a total of four (4) Programmable Digital Moiré Projectors.  This proprietary system yields precise height measurement used to detect lifted component and lifted lead defects as well as solder volume post reflow.  Fully configured the new MIRTEC MV-6e OMNI machines feature four (4) 10 Megapixel Side-View Cameras in addition to the 15 Megapixel Top-Down Camera. 

Also, stop by to see the MV-3L Desktop AOI Machine- the industry’s most widely accepted five (5) camera desktop AOI system.  This system is configured with one Top-Down View 10 Mega Pixel camera with a Precision 13.4um Telecentric Compound Lens and four (4) 10 Mega Pixel Side-View Cameras.  This advanced technology can also offer four-point height measurement capability for co-planarity testing of BGA and CSP devices as well as enhanced solder paste measurement capability via the INTELLI-BEAM® laser measurement option. This advanced technology provides: four-point height measurement capability for co-planarity testing of BGA and CSP devices as well as enhanced solder paste measurement capability. 

MIRTEC Europe prides itself on its business philosophy of providing customers with the highest quality products and services at competitive pricing, and recognizes that customers are the source of future growth and, as such, strives for a strong, reliable and long-term partnership based on trust and respect.

About MIRTEC

MIRTEC is a leading global supplier of Automated Optical Inspection Systems to the Electronics Manufacturing Industry. For further information, click here

Share

Print


Suggested Items

Comparing Soldering Results of ENIG and EPIG Post-steam Exposure

09/11/2019 | Jon Bengston and Richard DePoto, Uyemura International USA
Electroless nickel immersion gold (ENIG) is now a well-regarded finish used to enhance and preserve the solderability of copper circuits. Electroless palladium immersion gold (EPIG), meanwhile, is a new surface finish also for enhancing and preserving solderability—but with the advantage of eliminating electroless nickel from the deposit layer. This feature has become increasingly important with the increasing use of high-frequency PCB designs whereby nickel’s magnetic properties are detrimental.

Solder Mask Evolves into a Truly Additive Process

09/09/2019 | John Fix, Taiyo America Inc.
The 5G era is creating quite a bit of work for many PCB engineers as the materials required to keep up with the speed, frequency, and latency requirements need to be defined and qualified. Solder mask, for example, now becomes a truly additive process. Read on to find out how and why.

Selecting the Proper Flex Coverlayer Material

09/06/2019 | Dave Lackey, American Standard Circuits
Coverlayers are polymer materials used to cover and protect the copper traces of the flex circuit product. There are a number of different options available for protecting the circuits, and they serve different design requirements in terms of cost, performance, and flexural endurance optimization. When specifying the choice, it is critical to call out not just the type of coverlayer material but also the thickness requirement. This can be very important in certain types of constructions, especially when a flex circuit will experience dynamic flexing during use.



Copyright © 2019 I-Connect007. All rights reserved.