Kester to Exhibit and Present at SMTA China East/NEPCON China

Reading time ( words)

Kester will be exhibiting at the SMTA China East/NEPCON China event, which will take place April 25-27 at the Shanghai World Expo Exhibition & Convention Center. Kester will be at Booth 1H43.

Kester’s booth will offer attendees the opportunity to meet with the sales team and learn more about the company’s new products.

In addition, Kester’s Yanrong Shi will present “Surface Insulation Resistance of No-Clean Flux Residues Under Various Surface Mount Components” on April 25.

About Kester

Kester is a global supplier of assembly materials for the Electronic Assembly and Semiconductor Packaging industries. Kester is focused on delivering innovative, robust and high-quality solutions to help our customers address their technological challenges. Kester’s current product portfolio includes soldering attachment materials such as solder paste, soldering chemicals, TSF (tacky solder flux) materials, and metal products such as bar, solid and flux-cored wire. Kester is an Illinois Tool Works (ITW) company. ITW is a Fortune 200 company that produces engineered fasteners and components, equipment and consumable systems, and specialty products. It employs approximately 49,000 people, and is based in Glenview, Illinois, with operations in 57 countries.


Suggested Items

Manufacturability: Pad Relief and Mask Relationship to Solder Joint Volume

03/09/2018 | Ken Horky, Peterson Manufacturing
Electronic assembly thermal management has always been an issue but has become more significant as we pack more power and function into a smaller form factor. In recent years, the growing use of LEDs for illumination on a large scale has presented additional thermal demands.

RTW IPC APEX EXPO: Indium Discusses Fighting Solder Voids

03/06/2018 | Real Time with...IPC
Voiding has increasingly become one of the most critical challenges in the soldering process. In this interview, Christopher Nash, product manager for the PCB assembly solder paste business of Indium, speaks about how the company is helping customers address the voiding challenge.

RTW IPC APEX EXPO: Developments and Reliability Improvements in Solder Alloys

03/01/2018 | Real Time with...IPC
Tim O'Neill explains developments in solder alloys for cost-sensitive applications, and improvements in the reliability of alloys subjected to sustained high temperatures.

Copyright © 2018 I-Connect007. All rights reserved.