Microtronic to Intro Heavy Duty Solderability Tester at SMT Hybrid Packaging 2017


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Microtronic GmbH is pleased to announce that it will introduce its new LBT210-HD (Heavy duty) Solderability Tester in Stand 221J in Hall 5 at SMT Hybrid Packaging, scheduled to take place May 16-18, 2017 in Nuremburg, Germany. Microtronic remains the technology leader with the only heavy duty automatic and PC-controlled solderability tester. The revolutionary system is designed to meet today’s current industry challenges, accommodating heaver or larger parts that will not fit existing testers.

With the launch of the LBT210-HD, the maximum weight of a part that can be tested is now for forces up to 300mN instead of 40mN on the standard LBT210. Ernst Eggelaar, President of Microtronic commented, “This will be a major step for customers that could not test large parts or connector pins in the past. Previously there were not any systems designed to handle larger parts. Now Microtronic can offer this.”

The system is operated by using molten solder and measures the wetting force of the molten solder to the test part. This ensures a true value of the solder process. The system supports measurements using the common methods with a solder bath or a solder globule. All industry standards including IPC, IES, NF, MIL and JEDEC are supported.

About Microtronic

Microtronic was founded in 1981 and is based near Munich, Germany. With 30 years’ experience, we are the microelectronics leaders in Europe and offer a wide range of products and services to the microelectronics industries. We run regular training courses on various topics through in-house training or can arrange for specific employee training courses on request to suit your needs. 

Our customers include companies who require added solderability test, ultrasonic microscopes, circuit board repair systems, welding systems, solders and solder pastes. We offer centralised pricing to our customers with the added benefit of unparalleled delivery times from our centralized European warehouses.

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