Microtronic to Show Sonix ECHO Scanning Acoustic Microscope at SMT Hybrid Packaging


Reading time ( words)

Microtronic GmbH today announced plans to show the Sonix ECHO™ scanning acoustic microscope in Stand  221j in Hall 5 at SMT Hybrid Packaging, scheduled to take place May 16-18, 2017 in Nuremburg, Germany. The ECHO enables package inspection of stacked dies, complex flip chips and more traditional plastic packages.

The ECHO VS adds industry-leading features for the clearest imaging of Cu pillars, molded flip chip (MUF), CSP, MCM, stacked die, hybrids, and other advanced package inspection applications. The ECHO Pro adds fully automated handling for 100 percent package inspection in high-volume production environments.

Ernst J. M. Eggelaar, President of Microtronic commented, “We are excited to present the latest developments and features of the Sonix ECHO to our customers. The system offers many new and cutting-edge features.”

About Microtronic

Microtronic was founded in 1981 and is based near Munich, Germany. With 30 years’ experience, we are the microelectronics leaders in Europe and offer a wide range of products and services to the microelectronics industries. We run regular training courses on various topics through in-house training or can arrange for specific employee training courses on request to suit your needs. 

Our customers include companies who require added solderability test, ultrasonic microscopes, circuit board repair systems, welding systems, solders and solder pastes. We offer centralised pricing to our customers with the added benefit of unparalleled delivery times from our centralized European warehouses.

For more information, please click here.

Share


Suggested Items

Solder Printing Process Inputs Impacting Distribution of Paste Volume

12/14/2017 | Marco Lajoie and Alain Breton, C-MAC Microelectronics
The volume of solder deposition, like any process, has variations that may be characterized by a statistical distribution curve, whether normal or non-normal. As complexity, density, cost and reliability requirements increase, there may be value in narrowing the distribution curve. It is common sense that less variation serves the interest of quality of the more complex and dense circuit boards.

Improving Solder Paste Printing

12/12/2017 | Stephen Las Marias, I-Connect007
Of the three elements involved in the solder paste printing process—stencil, solder paste, and printer—the stencil is considered one of the major factors affecting the transfer efficiency, accuracy, and consistency, of solder pastes into the pads, especially with the continuing trend towards miniaturization.

Equipment Matters in Solder Paste Printing

12/06/2017 | Stephen Las Marias, I-Connect007
The solder paste printing process has always been considered a major contributor to yield loss. According to many studies, solder paste printing accounts for up to 70% of all PCB assembly defects. For the December issue of SMT Magazine, we interviewed experts in the solder paste printing process to learn more about the key issues leading to this huge percentage of defects, and the technology developments that are addressing these challenges and improving yields in the process.



Copyright © 2017 I-Connect007. All rights reserved.