Flex Officially Opens New Design Center in Israel


Reading time ( words)

EMS firm Flex Ltd has officially opened its new design center in Haifa, Israel. The Haifa Design Center was founded at the end of 2012 as part of Flex’s medical research and design initiatives. Due to the increase in projects and the number of hires, in December of 2016, the center was moved to a new 1,000m2 facility located in the southern part of Haifa. It is close to several large international companies such as: Google, Microsoft, Amdocs, Qualcomm, GE, Phillips, Intel, Elbit, Novocure. Currently, the center holds 40 expert design engineers on-site.

The new facility accommodates several labs to support ongoing projects and is equipped for electronic integration and testing, firmware inspection, mechanical assembly and 3D printing. It also has a mechanical workshop, a special lab for optical inspection and assembly, and a lab to support water purification systems.

During the opening of the new facility, Ziva Eger, Chief of Foreign Investment and Industrial Cooperation Authority in Israel, commented, "Flex is one of the key partners for the State of Israel in helping to build the Israeli economy."

Today, the Haifa design center is focused on projects from the medical, industrial, consumer and defense categories and is also the home for two additional Flex groups—the medical technology center and the Flexible Technologies and Miniaturization CoE.

Share


Suggested Items

Virtex on Military and Aerospace Requirements

04/26/2017 | Stephen Las Marias, I-Connect007
Brad Heath, VirTex CEO, and Upinder Singh, Vice President and General Manager at VirTex MTI, discuss their company's military and aerospace business, and how they are addressing the latest demands and requirements from their customers.

Achieving Successful Flex Circuit Assemblies

04/21/2017 | Stephen Las Marias, I-Connect007
In this article, Yousef Heidari, vice president of engineering at EMS firm SigmaTron International, talks about the varying challenges in flex-circuit assembly. Chief among these are the solder paste printing process, especially for designs that have multiple areas with fine-pitch components, as well as the subsequent handling of the assembly before final product integration.

JJS Stresses Need for Baking Prior to Flex Circuit Assembly

04/20/2017 | Stephen Las Marias, I-Connect007
From an assembly perspective, baking the flex circuits prior to manufacturing assembly is crucial as they can be susceptible to delamination. In this interview, Russell Poppe, director of technology at JJS Manufacturing explains why, as well as discusses other challenges in flex circuit assembly and strategies to address them.



Copyright © 2017 I-Connect007. All rights reserved.