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SHENMAO Technology, Inc., has joined iNEMI (International Electronics Manufacturing Initiative), a not-for-profit, highly efficient R&D consortium of approximately 90 leading electronics manufacturers, suppliers, associations, government agencies and universities, to participate in advancing manufacturing technologies.
As an award-winning supplier of electronics assembly materials, SHENMAO’s Advanced Material Development Center is collaborating closely with electronics manufacturers, universities, and research organizations in the field of innovative solder materials, assembly and advanced packaging technology.
For more information click here.
Patty Goldman, I-Connect007
At the SMTA West Penn Expo, I had a chance to discuss a paper presented by Jigar Patel, senior application engineer at ZESTRON. Jigar explained some of the cleaning challenges with newer components and how ZESTRON helps optimize cleaning processes for their customers.
Dora Yang, PCBCart
As a cutting-edge technology applied in SMT assembly, BGA packages have quickly become a significant selection to conform to fine pitch and ultrafine pitch technology, achieving high-density interconnection with a reliable assembly technology provided, which leads to the increasingly more applications of this type of package.
Real Time with... NEPCON China
At the recent NEPCON China 2018, Klaus Schubert, managing director of Armada, speaks about the increasing electrification in cars and how this is impacting the PCB assembly processes, and in particular, the solder paste printing.