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Indium Corporation will feature its void-reducing Indium8.9HF and Indium10.1 solder pastes to help customers Avoid the Void at NEPCON China 2017, April 25-27 in Shanghai.
Both Indium8.9HF and Indium10.1 deliver excellent response-to-pause printing performance, and remain stable for 30 days at room temperature and up to 12 months when refrigerated. These solder pasts are also equipped with a unique oxidation barrier technology that makes them perfectly suited for a variety of applications, especially automotive assembly.
For more information about Indium’s low-voiding solder pastes, click here.
Neil Sharp, JJS Manufacturing
Blockchain is one of the hottest topics in the tech world, and a buzzword that’s been popping up quite a bit over the last year or so. It is said to have the potential to radically simplify many business processes, by reducing risk and boosting transparency. In the manufacturing world, what are its opportunities?
Dieter G. Weiss, Weiss Engineering
Over the past 20 years, ceramic hybrids have changed more and more to a backyard living in the European electronics industry, mainly driven by price pressure, specifically from the automotive electronics industry.
Real Time With... NEPCON South China
During the recent NEPCON South China event in Shenzhen, Juergen Staedtler, CEO of Vermes Microdispensing GmbH, discusses their latest innovations in microdispensing, and how their piezo technology is addressing the trend towards miniaturization in PCB assemblies.