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Indium Corporation will feature its void-reducing Indium8.9HF and Indium10.1 solder pastes to help customers Avoid the Void at NEPCON China 2017, April 25-27 in Shanghai.
Both Indium8.9HF and Indium10.1 deliver excellent response-to-pause printing performance, and remain stable for 30 days at room temperature and up to 12 months when refrigerated. These solder pasts are also equipped with a unique oxidation barrier technology that makes them perfectly suited for a variety of applications, especially automotive assembly.
For more information about Indium’s low-voiding solder pastes, click here.
Philip Stoten, Scoop
The IPC Connected Factory Exchange (CFX) demo at the recent IPC APEX EXPO 2018 trade show in San Diego, California, is a great example of industry collaboration. The CFX Showcase at APEX had 245,000 CFX website page views; 701,200 CFX messages transmitted; and 664.5 million bytes of data exchanged; and the whole thing was pulled together in a matter of weeks. Here's what the participants in the program have got to say.
Real Time with...IPC
Craig Arcuri of COMET Technologies details the numerous ways his company's technology is employed to manufacture and inspect a wide range of products, from chips to jet engine turbine blades. He also speaks about Lab One, the company's new technology and application center in Silicon Valley.
Barry Matties, I-Connect007
Mycronic recently announced the acquisition of Vi TECHNOLOGY, with the intent of combining VIT’s inspection technology with Mycronic’s jetting capabilities. In an interview with I-Connect007, Olivier Pirou, Managing Director of VIT, discusses more about the merger and how this will help VIT contend in such a competitive environment.