Indium to Feature Void-Reducing Solder Pastes at NEPCON China 2017

Reading time ( words)

Indium Corporation will feature its void-reducing Indium8.9HF and Indium10.1 solder pastes to help customers Avoid the Void at NEPCON China 2017, April 25-27 in Shanghai. 

Both Indium8.9HF and Indium10.1 deliver excellent response-to-pause printing performance, and remain stable for 30 days at room temperature and up to 12 months when refrigerated. These solder pasts are also equipped with a unique oxidation barrier technology that makes them perfectly suited for a variety of applications, especially automotive assembly.

For more information about Indium’s low-voiding solder pastes, click here


Copyright © 2017 I-Connect007. All rights reserved.