Alpha to Present on Sintering Technology at PCIM 2017


Reading time ( words)

Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will present a paper titled "Double Side Sintered Diode + IGBT 650V/200A in a STO247 Package for High Performance Automotive Applications" at the PCIM Exhibition, Nuremberg, Germany on May 16.

The paper, to be presented by Julien Joguet, Global Product Manager for Sintered Materials for Alpha, a part of the MacDermid Performance Solutions group of businesses, will discuss the findings of a study which tested a double side sintered STO247 type packaged device that had been fully sintered using Alpha Argomax against the leading device on the market used in high-performance electric cars.

The reliability requirements for packaged devices are becoming more severe given the significantly higher power density levels in these applications that devices are subjected to over their operating life. Several new device technologies are emerging in the market to address the performance and reliability requirements.

"These technologies will be limited if advances in attachment methods do not evolve as well," said Joguet. "The Alpha Argomax silver sintering paste and film technologies for die attachment allow a fast, low-pressure process for a wide range of applications including power, RF, and high-power LEDs. This allows for high thermal and electrical conductivity silver bonds and flexible bondline thickness – both of which address issues with die attach reliability in high volume manufacturing processes."

To see the conclusions of this study, please visit the Exhibitor Forum at PCIM on Tuesday, May 16 at 10:20 am or visit us in Hall 7 Booth #518.

About Alpha Assembly Solutions

Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.

With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of Alpha electronics assembly material products, including solder paste, Exactalloy solder preforms, cored solder wire solder, wave soldering fluxes, bar solder alloys, and stencils. It offers die attach product technologies to the power electronics segment in its Argomax, Atrox and Fortibond brands.

For the LED segment, Alpha offers its Lumet products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications. 

Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here

Share


Suggested Items

Configure to Order: Different by Design

01/09/2018 | Michael Ford, Aegis Software Corp.
When considering implementation of Industry 4.0 solutions, following the hype in the market, attention typically is focused on the need for communication between machines on the shop-floor. Knowing what is currently executing and the status of each process in the factory, as well as all the related resources and support operations, provides critical information for Industry 4.0 computerized management systems.

Step Stencil Technologies and Their Effect on the SMT Printing Process

12/21/2017 | Greg Smith and Bill Kunkle, BlueRing Stencils, and Tony Lentz, FCT Assembly
Components such as quad flat no lead (QFNs), land grid array (LGAs), micro ball grid array (micro BGAs), 0201s and even 01005s continue to push manufacturers to use thinner stencil foils to apply the correct volume of paste onto their boards, but larger components such as edge connectors still require larger paste volumes.

What Matters Most is Communication

12/04/2017 | Stephen Las Marias, I-Connect007
While there may be new techniques and strategies, technologies, equipment, tools, and materials to employ and utilize, there is always one thing that will ensure the manufacturing/ assembly success of your product: communication. Communication between the designer and the assembler will help improve the manufacturability and assembly of the final product—even before the board design gets fabricated.



Copyright © 2018 I-Connect007. All rights reserved.