Alpha to Present Technical Papers at SMTA International Conference on Soldering and Reliability

Reading time ( words)

Alpha Assembly Solutions will present two papers at the SMTA International Conference on Soldering and Reliability (ICSR), which will be held in Markham, Ontario, on June 6–8, 2017.

Jason Fullerton, customer technical support (CTS) engineer at Alpha, will present "A Comparison of Localized Electronics Cleanliness Testing and Surface Insulation Resistance – Part 1." This paper is Fullerton's investigation and comparison of six no-clean liquid wave soldering fluxes and their performance using a Critical Cleanliness Control (C3) cleanliness tester and Surface Insulation Resistance (SIR) testing.

Karen Tellefsen, senior research chemist at Alpha, will deliver "The Effect of FR-4 Laminate Materials on the Surface Insulation Resistance of Wave Soldering Fluxes," a detailed analysis of how different laminate chemistry impacts surface insulation resistance (SIR) results since the implementation of Pb-free processing.

Both papers will be delivered as part of Session 4: Contamination and Cleanliness Testing, which is scheduled for June 7 from 3:30 pm – 4:30 pm.

Alpha, a part of the MacDermid Performance Solutions group of businesses, will also be exhibiting at the Expo & Tech Forum being held in conjunction with the conference on June 7. Alpha will showcase its portfolio of innovative materials and solutions for the electronics assembly industry and its Alpha Recycling Services capabilities. 

About SMTA

The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

About Alpha Assembly Solutions

Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others. 

With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA electronics assembly material products, including Solder Paste, Exactalloy Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils.  It offers die attach product technologies to the power electronics segment in its Argomax, Atrox and Fortibond brands. 

For the LED segment, Alpha offers its Lumet products covering applications from die attach to systems assembly in the LED manufacturing process.  Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.  

Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials.  For more information, click here.


Suggested Items

Under the Hood: Solder Joint Reliability

05/21/2018 | Burton Carpenter, NXP Semiconductors Inc.
It has been long established that packages using NSMD BGA pads were more resilient than ones with SMD pads to fatigue-induced solder joint cracks. However, NSMD pads in previous investigations on 292MAPBGA and 416PBGA packages failed sooner in AATS testing due to an alternate failure mode: substrate Cu trace cracks. This article looks into the effects of substrate material and package pad design on solder joint reliability of 0.8 mm pitch BGA.

Solving Reliability and Thermal Management Challenges in Automotive Electronics

05/01/2018 | Stephen Las Marias, I-Connect007
Paul Salerno, global portfolio manager for SMT assembly solutions at Alpha Assembly Solutions, discusses the growing automotive electronics industry, its impact on the soldering materials business, and how Alpha helps customers address the new challenges and requirements in the automotive market.

Investigating Analytical Tools for Testing Cleanliness with Foresite's Eric Camden

04/19/2018 | Patty Goldman, I-Connect007
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.

Copyright © 2018 I-Connect007. All rights reserved.