SMTA China Presents Awards at SMTA China East Conference/NEPCON China 2017


Reading time ( words)

SMTA China announces that it presented awards for seven papers and two exhibits at the SMTA China East Conference 2017 Award Presentation Ceremony, held on Tuesday, April 25, 2017 at the Shanghai World Expo Exhibition & Convention Center in conjunction with the SMTA China Annual Award Ceremony.

SMTA_Award1.jpg

Best Paper / Best Presentation Awards presented by SMTA China during the SMTA China East Conference 2017

SMTA_Award2.jpg

Best Emerging Exhibit / Best Exhibit Technology Awards presented by SMTA China during the SMTA China East Conference 2017 

Flex’s Henley Zhou was awarded The Best Paper of Technology Conference One for the paper titled “The Study of the Effect of PTH Diameter, Connection Type and Amount of Connected Copper On PTH Hole Fill Percentage By Wave Soldering.” 

KYZEN’s Daniel Gao was awarded The Best Paper of Technology Conference Two for the paper titled “Cleaning Agent Innovation for Highly Dense Electronic Assemblies.” 

Keith Bryant, from SMT Solutions, and Michael Tang, from YXLON International GmbH,  received the award for The Best Presentation of Technology Conference One for the presentation titled “Computer Tomography from Microelectronics to Assembled Products.” 

Dr. Wayne Koh, from Pacrim Technology Inc., received the award for The Best Presentation of Technology Conference Two for the presentation titled “Progress in Low Temperature Lead-Free Solder for SMT Assembly.” 

Ji Xu, from ASM Assembly Systems Ltd., received the award for The Best Presentation of Vendor Conference One for the presentation titled “Smart #1 SMT Factory - Our Smart Move to Industry 4.0.” 

Derek Wang, from AIM Solder (Shenzhen) Company Limited, received the award for The Best Presentation of Vendor Conference Two for the presentation titled “The Impact of Reduced Solder Alloy Powder Size on Solder Paste Print Performance.”

Yu Xiang, from Shenzhen City TongFang Electronic New-material Co., Ltd., received the award for The Best Presentation of Vendor Conference Three for the presentation titled “QFN Solder Void Solution Study.” 

Dongguan Anda Automation Equipment Co., Ltd. received the award for The Best Emerging Exhibit of the Year 2017 China East with the product of “Dispenser Machine” and Model of “AD-16”. 

Cencorp Automation Oy received the award for The Best Exhibit Technology of the Year 2017 China East with the product of “In-Line Router” and Model of “1000BR”.

Share


Suggested Items

Investigating Analytical Tools for Testing Cleanliness with Foresite's Eric Camden

04/19/2018 | Patty Goldman, I-Connect007
At the recent West Penn SMTA Expo, Eric Camden, lead investigator at Foresite Inc., speaks with I-Connect007's Patty Goldman about fluxes and analytical tools for testing cleanliness, and how these impact the reliability of the assembled boards.

Stencil Printing Techniques for Challenging Heterogeneous Assembly Applications

04/16/2018 | Mark Whitmore and Jeff Schake, ASM Assembly Systems
A new generation of near microscopic size SMT chip capacitors has appeared in the market, known as either 0201 or 008004. This article investigates and characterizes the stencil printing process for compatibility with M0201 capacitor assembly. Effects of circuit board quality, stencil thickness, and stencil nano-coating are evaluated against solder paste volume transfer efficiency and raw-volume print distribution.

Why AOI is a Must-have for PCB Assembly

04/05/2018 | Russell Poppe, JJS Manufacturing
AOI has an invaluable role to play in speeding up the process of PCB production, in ensuring extreme precision to catch even the smallest of defects, and in minimizing the potential for time-consuming and costly reworking.



Copyright © 2018 I-Connect007. All rights reserved.