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Goepel electronic has launched the latest version of its X Line · 3D in-line X-ray system, which features improvements in hardware and software functions to ensure even higher test speeds and shorter cycle times.
The X Line · 3D Series 300 offers improved PCB transfer, significantly reducing PCB assembly handling time. In addition, systems of the speed variant X40PLUS are now capable of scanning speeds of up to 510 mm/s during image acquisition. Also, the Series 300 has a new soft-stop option that can be used to stop circuit boards and ceramic substrates in seconds, thereby avoiding the risk of damage as with mechanical "hard stops".
On the software side, the new version of PILOT AXI 3.3, which is now available for the X Line · 3D, features advanced test functions that capture air inclusions (voids) and solder balls even more reliably. In addition, it has new filter options that provide additional image optimization.