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Goepel electronic has launched the latest version of its X Line · 3D in-line X-ray system, which features improvements in hardware and software functions to ensure even higher test speeds and shorter cycle times.
The X Line · 3D Series 300 offers improved PCB transfer, significantly reducing PCB assembly handling time. In addition, systems of the speed variant X40PLUS are now capable of scanning speeds of up to 510 mm/s during image acquisition. Also, the Series 300 has a new soft-stop option that can be used to stop circuit boards and ceramic substrates in seconds, thereby avoiding the risk of damage as with mechanical "hard stops".
On the software side, the new version of PILOT AXI 3.3, which is now available for the X Line · 3D, features advanced test functions that capture air inclusions (voids) and solder balls even more reliably. In addition, it has new filter options that provide additional image optimization.
Nolan Johnson, I-Connect007
Clemens Jargon, senior vice president of High Flex at Mycronic, shares his thoughts about the company’s performance in 2022 (it was a strong year), plans for the new year (turnkey solutions), and what visitors to the Mycronic booth at the show can expect to see in the company’s state-of-the-art Iris™ 3D AOI vision technology.
Andy Shaughnessy, I-Connect007
In this Q&A, Rob Rowland, director of engineering at Axiom Electronics, discusses his new IPC APEX EXPO Professional Development course, “Reflow Profiling Simplified,” on how to create a standardized methodology to accurately generate new reflow soldering profiles. Rob explains, “In this class, I’ll explain how I approached this work to help others develop similar methodologies for creating their own reflow soldering profiles. My presentation also includes the basic reflow profile recipes I have been using for the past 20 years.”
Pete Starkey, I-Connect007
Pete Starkey talks with Kevin Domancich at Essemtec at electronica 2022 about the company integration within Nano Dimension and how the two companies have pioneered an exciting new end-to-end manufacturing solution that helps customers speed up production, cut costs, and keep their proprietary materials secure. In a world where time to market has become a priority consideration, this universal system has the potential to revolutionize the industry.