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At the recent NEPCON China event in Shanghai, Daniel Werkhoven, CEO of Belgium-based soldering chemistry provider Interflux Electronics N.V., talks with I-Connect007 Managing Editor Stephen Las Marias about how their new bismuth-based solder alloy will help improve the soldering process.
Watch The Interview Here
MacDermid Enthone Electronics Solutions
MacDermid Enthone Electronics Solutions to exhibit at HKPCA tradeshow, Shenzhen, China, December 5-7, 2018.
Stephen Las Marias, I-Connect007
The majority of the respondents in our survey stated that they expect low-temperature soldering to result in higher quality PCBAs.
David Geiger, Robert Pennings, and Jane Feng, Flex
Components continue to shrink in the SMT world, and the next evolution of passive components includes m03015 (009005) and m0201 (008004). The m03015 and the m0201 components will see primary adoption in products that require further miniaturization, which would be SiPs. These modules would then be assembled into products through attachment, another assembly, or via other interconnect methods. This article explores the development of an assembly process (SMT only) for the m03015 component.