-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Logic PD Appoints Eric Wilkowske as VP of Products, Design & Engineering
July 20, 2017 | WEBWIREEstimated reading time: 1 minute
EMS firm Logic PD has named Eric Wilkowske to the role of vice president of products, design and engineering. Prior to the appointment, Wilkowske served as the company's vice president of account management.
In his new role, Wilkowske will oversee all day-to-day operations within the design and engineering and embedded products groups. He will also spearhead efforts to help customers achieve their strategic growth initiatives through creating innovative connected devices. Wilkowske will report to Logic PD President and CEO Bruce DeWitt.
"Eric has a deep appreciation and understanding of our customers' product development and time-to-market needs, and he will ensure we deliver on our promise of excellence," said DeWitt. "I have complete confidence in Eric's ability to drive operational excellence and help our customers realize the full potential of Logic PD's engineering services. His expertise in product development coupled with his strategic business development leadership qualities are ideal for this position."
A seasoned product development innovator, Wilkowske joined Logic PD in 2015. Previously, he held the role of senior global product manager within the medication delivery division at Smiths Medical. In this position, he was responsible for developing and innovating next generation products, market sizing, portfolio planning, strategic planning, product pipeline prioritization, and forecasting.
Earlier in his career, Wilkowske spent five years with St. Jude Medical as manager for product development and business development where he led cross-functional engineering product development teams with budgets of more than $2 million and earned six patents for his work in catheters. Wilkowske also worked at MTS Systems Corporation as senior business development & program manager where he was responsible for market research, business development, research and development of new products, contract formulation projects and international business.
A resident of North Oaks, Minnesota, Wilkowske has dual degrees in mechanical engineering and economics as well as an M.S. in management of technology from the Carlson School of Management at the University of Minnesota.
About Logic PD
Logic PD collaborates with clients to guide them throughout the complete lifecycle of their Design & Engineering and Electronics Manufacturing Services needs to accelerate their growth and capture value. With integrated capabilities in research, design, engineering, quality, regulatory, manufacturing, and aftermarket services, Logic PD helps its clients identify opportunities, reduce risk, and control costs to deliver the next generation of innovative products into the world’s most demanding markets.
Suggested Items
iNEMI Packaging Tech Topic Series: Role of EDA in Advanced Semiconductor Packaging
04/26/2024 | iNEMIAdvanced semiconductor packaging with heterogenous integration has made on-package integration of multiple chips a crucial part of finding alternatives to transistor scaling. Historically, EDA tools for front-end and back-end design have evolved separately; however, design complexity and the increased number of die-to-die or die-to-substrate interconnections has led to the need for EDA tools that can support integration of overall design planning, implementation, and system analysis in a single cockpit.
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
Ansys, TSMC Enable a Multiphysics Platform for Optics and Photonics, Addressing Needs of AI, HPC Silicon Systems
04/25/2024 | PRNewswireAnsys announced a collaboration with TSMC on multiphysics software for TSMC's Compact Universal Photonic Engines (COUPE). COUPE is a cutting-edge Silicon Photonics (SiPh) integration system and Co-Packaged Optics platform that mitigates coupling loss while significantly accelerating chip-to-chip and machine-to-machine communication.
Siemens’ Breakthrough Veloce CS Transforms Emulation and Prototyping with Three Novel Products
04/24/2024 | Siemens Digital Industries SoftwareSiemens Digital Industries Software launched the Veloce™ CS hardware-assisted verification and validation system. In a first for the EDA (Electronic Design Automation) industry, Veloce CS incorporates hardware emulation, enterprise prototyping and software prototyping and is built on two highly advanced integrated circuits (ICs) – Siemens’ new, purpose-built Crystal accelerator chip for emulation and the AMD Versal™ Premium VP1902 FPGA adaptive SoC (System-on-a-chip) for enterprise and software prototyping.
Listen Up! The Intricacies of PCB Drilling Detailed in New Podcast Episode
04/25/2024 | I-Connect007In episode 5 of the podcast series, On the Line With: Designing for Reality, Nolan Johnson and Matt Stevenson continue down the manufacturing process, this time focusing on the post-lamination drilling process for PCBs. Matt and Nolan delve into the intricacies of the PCB drilling process, highlighting the importance of hole quality, drill parameters, and design optimization to ensure smooth manufacturing. The conversation covers topics such as drill bit sizes, aspect ratios, vias, challenges in drilling, and ways to enhance efficiency in the drilling department.