Indium to Host Seminar on Solder Joint Reliability for Automotive Electronics in Taiwan


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Indium Corporation will partner with 3S Silicon Tech Inc. to host a technology seminar on solder joint reliability for automotive electronics on August 11, 2017 in Hsinchu, Taiwan.

Technical experts from both companies will detail high-reliability technology and materials for automotive electronics applications, including high-reliability alloys and low-temperature solders; reliable materials for SiP applications; power semiconductor developments and applications in the automotive market; and vacuum oven reflow technology and applications.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

3S is a total solutions provider of die bonding in discrete power devices. 3S was established in 1998, headquartered in Hsinchu, with branch offices and sales offices in Shanghai, Singapore, Philippines and Malaysia.

For more information about Indium Corporation, click here.

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