CalcuQuote to Debut Purchasing Application for EMS at SMTA International

Reading time ( words)

CalcuQuote will launch a new procurement software for electronics manufacturing services (EMS) companies at the SMTA International Expo, which will be held September 20–21, 2017. This innovative, new solution, called ​shopCQ, will improve the purchasing process for contract manufacturers buying electronic components.

“ShopCQ is designed around the principles of CalcuQuote: leverage direct connections with industry leading component distributors to improve the efficiency of supply chain transactions,” said Chintan Sutaria, Founder and President of CalcuQuote. “It will quickly look up component pricing and availability, tie back to your RFQ process and place parts on order.”

After launching their first product at SMTA International in 2015, CalcuQuote has since become an industry-leader in quoting software for electronics contract manufacturing companies, providing a fast, accurate quoting system. 

CalcuQuote will be exhibiting their solutions for the electronics supply chain at Booth #909.

About CalcuQuote

CalcuQuote builds software applications for electronics manufacturing services (EMS) companies, including an RFQ management system, custom ERP integrations, and a procurement application for purchasing electronic components.


Suggested Items

Top 10 Most-Read SMT Articles of 2017

12/29/2017 | I-Connect007
Every year, we like to take a look back at the most popular SMT news and articles. These are the top 10 most-read SMT articles from the past year.

Evaluation of Stencil Technology for Miniaturization

12/22/2017 | Neeta Agarwal, et al.*
SMT stencil printing technology continually evolves to keep pace with device miniaturization technologies. Printed circuit board assemblers have numerous new technology options to choose from, and need to determine the most effective ones to produce the highest quality and most reliable solder interconnections.

Solder Printing Process Inputs Impacting Distribution of Paste Volume

12/14/2017 | Marco Lajoie and Alain Breton, C-MAC Microelectronics
The volume of solder deposition, like any process, has variations that may be characterized by a statistical distribution curve, whether normal or non-normal. As complexity, density, cost and reliability requirements increase, there may be value in narrowing the distribution curve. It is common sense that less variation serves the interest of quality of the more complex and dense circuit boards.

Copyright © 2018 I-Connect007. All rights reserved.