AIM to Host Knowledge Sharing Session on August 24


Reading time ( words)

AIM Solder will host a Knowledge Sharing Session in Queretaro, Qro, Mexico on August 24, 2017.

AIM’s Manuel Munguia, Senior Technical Support Engineer, will present the white paper “Assessing the Effectiveness of I/O Stencil Aperture Modifications on BTC Void Reduction.” Many of the published center pad voiding studies have focused on optimizing center pad footprint and stencil aperture designs. Manuel’s presentation will highlight a no-cost, easily implemented I/O design guideline that can be deployed to consistently and repeatedly reduce void formation on BTC-style packages.

This free seminar, hosted by AIM, SmartSol Technologies and Reymet, will be held at the Holiday Inn Queretaro, Zona Krystal in Queretaro, Mexico. This Knowledge Sharing Session will consist of four conferences, with speakers from AIM, KYZEN, Nordson Matrix and ASM Technologies, covering topics from void reduction to cleaning a no-clean flux.

To register, please click here.

About Manuel Munguia

Manuel Munguia is a Certified IPC Specialist with over fifteen years of experience in the solder assembly materials industry, four of which came from his former position with AIM as a Technical Applications Engineer. In his current role as Senior Technical Support Engineer, Manuel is responsible for supporting key corporate accounts in Mexico, Central and South America.

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, click here.

Share

Print


Suggested Items

Blackfox Trains Veterans for Good Manufacturing Jobs

02/18/2020 | Real Time with...IPC
Blackfox Training Institute has been training manufacturing technologists for over 20 years. Based in Longmont, Colorado, Blackfox is now focused on helping veterans of our armed services transition into good jobs in the manufacturing sector. During IPC APEX EXPO 2020, Editor Nolan Johnson spoke with Blackfox CEO Al Dill about the company's veteran training programs, and how this effort is helping companies fill jobs that might otherwise go unfilled.

Solder in PCBA: Can’t Live Without It... or Can We?

02/17/2020 | Joe Fjelstad, Verdant Electronics
For most of its historical use in electronics, the solder alloy of choice was tin-lead, either an Sn60/Pb40 alloy or the Sn63/ Pb37 eutectic version of the tin-lead alloy. These two alloys were the workhorses of the industry. They were both well understood in terms of their processing and reliability—that is, until the advent of lead-free, a well-meaning but ill-conceived and poorly executed conversion, forced on the industry by the European Union in 2006.

IPC APEX EXPO 2020 Attendees Speak: Dr. Martin Anselm

02/14/2020 | I-Connect007 Editorial Team
"The biggest challenge I’ve encountered a number of different times is the migration to much larger packaging," said Dr. Martin Anselm, director of CEMA Lab. "Devices are getting much larger, and with the thousands of I/O of solder joints, and they are not just single-die, multi-chip modules in different forms or 2.5D technologies.



Copyright © 2020 I-Connect007. All rights reserved.