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EVS International scheduled to take place Sept. 19-20, 2017 at the Donald Stephens Convention Center in Rosemont, Illinois. EVS will show the EVS 500LF Solder Recovery System. With the new concept of improved performance plus the significant reduction in price, everyone can enjoy the savings that EVS solder recovery systems can offer.
The EVS500LF is designed to ensure that the maximum recovery is maintained throughout the life of the wave solder system. Users can quickly recover up to 80 percent of pure solder with a higher ROI from the waste dross. EVS has continually improved the performance of the EVS units and the new EVS 500LF is no exception.
The EVS 500LF has the same footprint as a printer and is aimed at multiple markets: The customer with one lead wave and one lead-free wave; the customer who uses Nitrogen or wants to reduce their Nitrogen usage; the customer with selective solder pots who only removes small amounts of dross every hour; or the customer with multiple waves where one EVS 500LF is connected to each wave.
For more information about EVS International’s industry-leading systems, click here.
Barry Matties, I-Connect007
Barry Matties met with Karthik Vijay, Indium Corporation's technical manager for Europe, at last year's productronica, where everything from stencils and laser cutting to flux technology and jetting were discussed. If you want to know about where material technology currently stands in the automotive landscape, you’ll want to read on.
Bob Wettermann, BEST Inc.
There are a variety of reasons behind pads getting "lifted" completely or partially from the laminate of a PCB. Per the just revised IPC-A-610 Revision G, a defect for all three classes occurs when the land is lifted up one or more pad thicknesses. Lifted pads can occur when a device has been improperly removed or there is a manufacturing defect in the board construction. In any case, as with any repair, the ultimate decision on the ability to repair the pad lies with the customer.
Another year is over in the SMT industry. 2017 saw a myriad of hot topics, including Industry 4.0, the millennials’ entry into the manufacturing space, and alternative solder materials, to name a few. Without further ado, here are the Top 10 columns from SMT007 over the past year.