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Alpha Assembly Solutions will be featuring its latest low temperature and void reduction assembly process technology solutions and giving multiple presentations during the SMTA International 2017 Conference and Exhibition, to be held September 17–21, 2017 at the Donald E. Stephens Covention Center in Rosemont, Illinois. Alpha will be at Booth 1016.
New products to be highlighted at the show include a new generation low temperature solder paste, ALPHA OM-550 and the innovative void reduction ALPHA AccuFlux Technology for solder preforms.
"OM-550 provides another low temperature solution to customers looking for SAC305-type mechanical and thermal reliability in a low temperature alloy," says Robert Wallace, regional marketing manager for the Americas. "We feel this paste provides customers with efficiencies in both energy and cost while improving BGA mechanical reliability compared to other low temp alloys."
Both products will be included in the New Product Showcase and will also be a focus in several of the technical papers being presented.
"Alpha has developed an innovative void reduction technology," says Jerry Sidone, product manager for engineered materials at Alpha Assembly Solutions. "The latest AccuFlux Technology for preforms has been specially designed to dramatically decrease voiding under bottom termination components, an issue of increasing importance as power densities continue to rise and managing thermal reliability becomes more of a challenge. Our paper, Void Reduction Strategy for Bottom Termination Components (BTC) Using Special Flux Coated Preforms, will present the results of a comprehensive study that Alpha and our partners recently conducted to examine the impact of Alpha’s AccuFlux Preform Technology on voiding under QFNs, QFPs and DPAK packages."
In total, Alpha will be presenting eight papers during the four day event, two of which will focus on low temperature technology and three addressing void reduction:
- Void Reduction Strategy for Bottom Termination Components (BTC) Using Special Flux Coated Preforms
- Novel Mid-Temperature Alloy for Enabling Solder Processing Temperature Heirarchy in SMT Assembly
- High Performance Electronic Interconnect Materials Characterization – Techniques & Challenges
- Low Temperature Soldering Using Sn-Bi Alloys
- A Comparison of Localized Electronics Cleanliness Testing and Surface Insulation
- Effect of Voids on Thermo-Mechanical Reliability of Solder Joints
- Process, Design, and Material Factors for Voiding Control for Thermally Demanding Applications
- Low-Temperature Solder Paste Process Advantages.
To learn more about Alpha’s latest technologies and products, visit Booth #1016 at SMTAI or visit the Alpha Assembly Solutions website at alphaassembly.com.
The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. For more information, click here.
About Alpha Assembly Solutions
Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.
With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA electronics assembly material products, including Solder Paste, Exactalloy Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils. It offers die attach product technologies to the power electronics segment in its Argomax, Atrox and Fortibond brands.
For the LED segment, Alpha offers its Lumet products covering applications from die attach to systems assembly in the LED manufacturing process. Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications.
Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials. For more information, click here.