Indium's Brook Sandy-Smith to Lead Warpage Discussion at SMTAI


Reading time ( words)

Indium Corporation's Brook Sandy-Smith, Technical Support Engineer for PCB Assembly Materials, will lead a special panel discussion of industry experts at the SMTA International (SMTAI) 2017 Technical Conference on September 20 in Rosemont, Illinois.

The discussion, led by Sandy-Smith and Co-Chair Eric Moen of Akrometrix, LLC, will cover warpage induced defects and component warpage limits. Panel participants include Alex Chan, Nokia; Martin Anselm, Rochester Institute of Technology; Dudi Amir, Intel Corp.; and Neil Hubble, Akrometrix LLC.

The panel discussion is scheduled to start at 2 p.m. in the SMTAI Show Floor Theater. It will also be streamed live on Facebook. Go to www.facebook.com/indium for streaming details closer to the event date.

SMTAI is a world-class electronics manufacturing conference and exhibition organized by the SMTA — the world's leading user group for surface mount and companion technologies. The conference provides high-quality technical information and networking opportunities.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, click here.

Share

Print


Suggested Items

UV-curable Materials and Conformal Coatings

12/23/2019 | Pete Starkey, I-Connect007
Pete Starkey and Phil Kinner, global business and technical director, coatings division, Electrolube, discuss the characteristics and benefits of the company’s new UV-cured conformal coatings. Phil also describes the development of coatings for critical avionics applications and Electrolube’s collaboration with the U.K. National Physical Laboratory to establish a new condensation test.

IPC Electronics Materials Forum 2019

10/16/2019 | IPC
IPC will be holding its Electronics Materials Forum 2019 from November 5–7, 2019, in Bloomington, Minnesota. The Electronics Materials Forum is a new technical conference focused on developments in materials and processes associated with advanced electronics assembly and manufacturing.

Meet Chris Ellis, SMT007 Columnist

09/18/2019 | I-Connect007
Meet Chris Ellis, one of our newest SMT007 columnists! In his columns, Ellis addresses common problems that Manncorp customers have had with the in-house conversion process, and shares solutions that have worked in the past.



Copyright © 2020 I-Connect007. All rights reserved.