AIM Solder's Flopy Feng to Present at SMTA China South Technology Conference


Reading time ( words)

AIM Solder Technical Support Engineer Flopy Feng will present at the SMTA China South Technology Conference on August 29, 2017 at the Shenzhen Convention & Exhibition Center in Shenzhen, China.

Feng’s presentation will highlight the benefits and implications of finer mesh solder powder on critical aspects of solder paste performance. In this study, the key input variables included powder size, effect of room temperature storage, pause time and PCB feature types. Output included print transfer efficiency, volume repeatability and performance stability over time.

Having worked as a process supervisor for seven years, Feng is experienced in process evaluation and optimization. With over 14 years’ experience in the SMT industry, Feng supports AIM customers in south China.  

About AIM

Headquartered in Montreal, Canada, AIM Solder is a leading global manufacturer of assembly materials for the electronics industry with manufacturing, distribution and support facilities located throughout the world. AIM produces advanced solder products such as solder paste, liquid flux, cored wire, bar solder, epoxies, lead-free and halogen-free solder products, preforms, and specialty alloys such as indium and gold for a broad range of industries. A recipient of many prestigious SMT industry awards, AIM is strongly committed to innovative research and development of product and process improvement as well as providing customers with superior technical support, service and training. For more information about AIM, visit www.aimsolder.com.

Share


Suggested Items

The Vital Role of Solder Paste Printing in New Product Introduction

02/22/2018 | Richard Barratt, JJS Manufacturing
The high degree of automation within the SMT methodology offers a variety of advantages, from automatic correction of errors, to simpler and faster assembly, better mechanical performance, increased production rates and reduced labor costs. In this first in a series of articles exploring SMT assembly, we highlight the specific attributes, and the vital importance, of the solder paste printing process for your NPI.

Working with Customers: A Consultant's Perspective

02/19/2018 | Stephen Las Marias, I-Connect007
Industry veteran and expert Chrys Shea is in a unique position when it comes to her work for the electronics assembly industry. As president of consulting firm Shea Engineering Services, she helps suppliers test and bring new products to the market, and helps assemblers bring new processes or skills to their assembly lines.

SuperDry’s Novel Approach to the Drying Process

02/07/2018 | Pete Starkey, I-Connect007
Pete Starkey spent a few minutes at the SuperDry booth on the first day of the productroncica show, and chatted with old friend Rich Heimsch, who taught the old dog a few new tricks about the drying process.



Copyright © 2018 I-Connect007. All rights reserved.