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NEPCON South China 2017, being held in conjunction with the Shenzhen Circuit Sourcing 2017 (CS Show) and Automotive World China (AWC), opens its doors today at the Shenzhen Convention and Exhibition Center in Shenzhen, Guangdong Province in China to showcase nearly 600 companies catering to the electronics manufacturing industry.
This year’s event, the largest ever in the show’s 30-year history, features 45,000 square meters of exhibition space. The exhibition allows visitors to see product demonstrations and solutions related to SMT, EMA, soldering and dispensing, test and measurement, and other core elements along the electronics industry value chain.
NEPCON South China 2017 also features dozens of high-quality seminars and technology conferences in partnership with the Surface Mount Technology Association (SMTA) and the SMTA China South Chapter. The SMTA China South Conference 2017, featuring a technology conference and a vendor conference, has a lineup of talks and presentations about the latest innovations in electronics manufacturing technologies.
Stay tuned for our RealTime with… NEPCON South China 2017 coverage, which features video interviews of leading innovators and leaders in the industry, and an extensive photo gallery of the event.
Every year, we like to take a look back at the most popular SMT news and articles. These are the top 10 most-read SMT articles from the past year.
Neeta Agarwal, et al.*
SMT stencil printing technology continually evolves to keep pace with device miniaturization technologies. Printed circuit board assemblers have numerous new technology options to choose from, and need to determine the most effective ones to produce the highest quality and most reliable solder interconnections.
Marco Lajoie and Alain Breton, C-MAC Microelectronics
The volume of solder deposition, like any process, has variations that may be characterized by a statistical distribution curve, whether normal or non-normal. As complexity, density, cost and reliability requirements increase, there may be value in narrowing the distribution curve. It is common sense that less variation serves the interest of quality of the more complex and dense circuit boards.