Alpha to Present and Chair Multiple Technical Sessions at SMTAI 2017

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Alpha Assembly Solutions will present eight technical papers and will chair three panels during the SMTA International Conference and Exhibition, to be held September 17–21 at the Donald E. Stephens Convention Center in Rosemont, Illinois.

Three papers will focus on Alpha's new products and technologies to be featured during the show—a new-generation, low temperature solder paste ALPHA OM-550 and the innovative void reduction ALPHA AccuFlux Technology for solder preforms. One of the papers will discuss Alpha's latest work on low temperature technology, "Low Temperature Soldering Using Sn-Bi Alloys."

New technology for reducing voiding will be the focus of the presentation, "Void Reduction Strategy for Bottom Termination Components (BTC) Using Special Flux Coated Preforms."

"Alpha is looking forward to presenting our new product innovations and educating our customers on the value associated with these technologies," says Robert Wallace, Regional Marketing Manager for the Americas. "We believe that the increased reliability and efficiencies with cost will be of considerable use to our customers."

Additional papers will address the topic of voiding, as well as alloys for LEDs and SMT assembly, interconnect materials, and testing:

  • Effect of Voids on Thermo-Mechanical Reliability of Solder Joints and Process, Design
  • Material Factors for Voiding Control for Thermally Demanding Applications
  • Novel Mid-Temperature Alloy for Enabling Solder Processing Temperature Heirarchy in SMT  Assembly
  • High Performance Electronic Interconnect Materials Characterization – Techniques & Challenges
  • A Comparison of Localized Electronics Cleanliness Testing and Surface Insulation Resistance

Alpha will also chair or co-chair three technical sessions: Quality & Reliability, Solder Alloys, and Reflow.

To learn more about Alpha's latest technologies and products, visit Booth #1016 at SMTAI.

About SMTA

The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. For more information, click here.

About Alpha Assembly Solutions

Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.

With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA electronics assembly material products, including Solder Paste, Exactalloy Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils.  It offers die attach product technologies to the power electronics segment in its Argomax, Atrox and Fortibond brands.

For the LED segment, Alpha offers its Lumet products covering applications from die attach to systems assembly in the LED manufacturing process.  Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications. 

Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials.  For more information, click here.


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