SMART Group Launches Guide to QFN/LGA & BTC Process Defects


Reading time ( words)

SMART Group's latest Process Defect Photo Guide, "Guide to QFN/LGA & BTC Process Defects", will be released on October 16. This optical and X-ray guide covers the most common components, assembly process and reliability failures that may occur using these parts. It shows issues at goods receipt, typical assembly-related problems plus solder joint and cleanliness failures that can occur in the field. The guide provides example images of satisfactory print, placement and reflow with many common defects found with optical and X-ray inspection.

Register for the guide here. A download link will be sent on October 16. Simply fill in the form provided to be among the first to receive a copy of the latest Defect Guide.

In addition to this new, free Defect Guide, SMART Group will present a free webinar entitled QFN/LGA & BTC Process Defects – Causes & Cures on Monday 16th October at 2:30 p.m. UK time. The webinar will feature a step-by-step process overview to successfully implementing QFN/LGA & BTC packages as well as the most common failures and corrective action. The guide’s author Bob Willis has had experience in processing these parts in many different soldering process, printing and paste jetting plus conformal coating and successful cleaning processes. To register for the webinar, click here.

Many Defect Guides including Lead-Free have been produced by Bob Willis for the SMART Group and other organisations and magazines. Bob has produced guides/reports on Lead-Free, PCB Surface Finishes, Pin In Hole Reflow, Double-Sided Reflow, PoP Technology, Conformal Coating & PCB Cleaning Failures. Report and guides have also been circulated worldwide by the SMTA to raise money for charity.

For more information about the SMART Group, click here.

Share

Print


Suggested Items

Solder Paste Printing From the Stencil’s Perspective

02/19/2020 | I-Connect007 Editorial Team
Jeff Schake of ASM Assembly Systems discusses the complications surrounding printing and solder paste that he sees from his perspective as a stencil expert.

Blackfox Trains Veterans for Good Manufacturing Jobs

02/18/2020 | Real Time with...IPC
Blackfox Training Institute has been training manufacturing technologists for over 20 years. Based in Longmont, Colorado, Blackfox is now focused on helping veterans of our armed services transition into good jobs in the manufacturing sector. During IPC APEX EXPO 2020, Editor Nolan Johnson spoke with Blackfox CEO Al Dill about the company's veteran training programs, and how this effort is helping companies fill jobs that might otherwise go unfilled.

Solder in PCBA: Can’t Live Without It... or Can We?

02/17/2020 | Joe Fjelstad, Verdant Electronics
For most of its historical use in electronics, the solder alloy of choice was tin-lead, either an Sn60/Pb40 alloy or the Sn63/ Pb37 eutectic version of the tin-lead alloy. These two alloys were the workhorses of the industry. They were both well understood in terms of their processing and reliability—that is, until the advent of lead-free, a well-meaning but ill-conceived and poorly executed conversion, forced on the industry by the European Union in 2006.



Copyright © 2020 I-Connect007. All rights reserved.