Grupo Mirgor Earns IPC-J-STD-001/610 Certification


Reading time ( words)

IPC’s Validation Services Program has awarded the first IPC-J-STD-001 and IPC-A-610 Qualified Manufacturers Listing (QML), in South America, to Grupo Mirgor, Rio Grande, Argentina.

Eduardo Koroch, Mirgor’s industrial director engaged with IPC staff at IPC APEX EXPO in March 2016. From this meeting, he returned to his factory and began an extensive training program around the IPC standards. Thus, Mirgor successfully completed an intensive audit to IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies and IPC-A-610, Acceptability of Electronic Assemblies. The facility exceeded the requirements for the electronics industry’s rigorous classification, Class 2, which is intended for dedicated service electronic products. As a result, the company will be listed as an IPC-trusted source capable of manufacturing in accordance with industry best practices. Mirgor and other trusted sources of supply can be found on IPC’s QML/QPL (Qualified Product Listing) database.

“Upon returning to our facility from IPC APEX EXPO 2016, we established a training program, including advanced training for five instructors and training for 20 specialists,” said Koroch. “As a result of the training to IPC standards we successfully completed the IPC QML audit and substantially improved our processes, the quality of the products we manufacture, the mastery of processes through knowledge and, above all, the motivation of the staff who participated in this whole process.”

“Mirgor has differentiated itself from the competition by achieving this certification. They have proven their dedication to consistent high quality by complying with IPC standards and this positions the company for success,” said Randy Cherry, IPC director of Validation Services. “We are pleased to recognize Mirgor at the first company in South America to earn QML certification to IPC-J-STD-001/610.”

Share


Suggested Items

HDI Considerations: Interview with ACDi's Garret Maxson

11/10/2017 | Stephen Las Marias, I-Connect007
Garret Maxson, manager of engineering services at American Computer Development Inc. (ACDi), discusses the PCB assembly challenges when dealing with high-density interconnect (HDI) boards, parameters to consider, and strategies to help facilitate a smooth assembly process when using HDI boards.

Reliability of ENEPIG by Sequential Thermal Cycling and Aging

11/06/2017 | Reza Ghaffarian, Jet Propulsion Laboratory, California Institute of Technology
Electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish for PCBs has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This article presents the reliability of LGA component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.

Achieving the Perfect Solder Joint: The Many Perspectives on Soldering

10/30/2017 | Stephen Las Marias, I-Connect007
For this month's issue of SMT Magazine, we brought several experts together to discuss the many aspects of soldering, from solder paste, to automation, inspection, and the challenges in achieving the perfect solder joint. We also talked about the strategies and parameters to consider to ensure reliable, good solder joints.



Copyright © 2017 I-Connect007. All rights reserved.