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Robert Boguski, president of Datest, a provider of advanced, efficient and mission-critical in-circuit testing, test engineering and X-ray inspection solutions, will Chair Session TI Keynote & TI3 at SMTA International. The session, entitled, “The Roadmap and the Reaction: Challenges and Responses in Advanced Assembly Technology,” is scheduled to take place September 18, 2017, from 12:30–3pm. Speakers for the session include keynote speaker Bill Bader from iNEMI; John Timmerman, Ph.D., from Henkel; and Luis Carlos Montemayor, from Dow Corning Corp.
It is no secret that technology drives assembly innovation. Relentless demands for product miniaturization; durability; performance; reduced energy consumption and carbon footprints; together with demands for packaging design elegance, such as visual attractiveness and cost competitiveness, supply the impetus for change. Assembly processes struggle to keep pace with this never-ending evolution.
This session will address the general as well as the particular—a call and two responses—illustrating the impending changes that we as an industry confront. The keynote presentation will highlight technical challenges anticipated over the next decade, while the other two speakers will address specific industry responses to those challenges in the area of adhesive technology.
Boguski is a 1981 graduate of the University of San Francisco, with a BA in economics. He has worked in the electronics packaging and interconnect manufacturing business, primarily in management positions, since 1975. Boguski has 22 years in the bare board business, 12 years in the EMS business, and 12 years in the testing and test engineering business. He is the owner and president of Datest, a test engineering and failure analysis company in Fremont, California. Both Boguski and Datest are members of EIPC, SMTA, IPC and IEEE. Since 2013 Boguski has coauthored the Test and Measurement column for Circuits Assembly magazine. He is currently the president of the SMTA Silicon Valley Chapter.
Datest is the preeminent provider of advanced, efficient, and cost-effective PCBA testing, test engineering, failure analysis and analytical solutions. Established in 1984, Datest now offers in-circuit and flying probe testing and development services; DFT/DFM analysis; JTAG/Boundary Scan development services; AXI as well as 2D and 3D X-ray and CT-scan capabilities for nondestructive failure analysis, root cause identification, and dispute resolution. The company also offers cross-sectioning, dye & pry, and analytical laboratory services, including SEM and C-SAM analysis; counterfeit component identification and detection; and reverse engineering services. Datest is ITAR registered and has a quality management system (QMS) that is certified to ISO9001 and AS9100C. For more information, call 510-490-4600 or consult www.datest.com.