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Ralf Wagenfuehr, plant manager at Rehm Thermal Systems, speaks with I-Connect007 Managing Editor Stephen Las Marias during the recent NEPCON South China event in Shenzhen about the need for a common communications platform or interface as the industry moves toward Industry 4.0. He talks about how their new ViCON software can help manufacturers achieve the smart factory vision.
Wagenfuehr also discusses how vacuum technology helps eliminate voiding in reflow soldering.
Watch the Interview Here
Stephen Las Marias, I-Connect007
In this interview with I-Connect007, Indium Corporation Technical Manager Jonas Sjoberg discusses voiding and other key challenges in soldering, as well as an automotive electronics testing standard based out of South Korea that is seeing increased utilization all over Asia. He also talks about the increasing trend in manufacturers moving to Type 5 and Type 6 solder powders, and how this is causing its own set of challenges in printing.
Real Time With... NEPCON South China
Ralf Wagenfuehr, plant manager of Rehm Thermal Systems (Dongguan) Ltd, speaks with I-Connect007’s Edy Yu about the developments in the company’s convection reflow soldering system, which features a vacuum module, aimed at addressing the increasing demand for vacuum soldering. He also discusses their software developments, as well as how they are helping their customers toward their Industry 4.0 journey.
Russell Poppe, JJS Manufacturing
Much has been written about the increasing shortages of electronic components such as MLCCs, chip resistors and other semiconductor devices. And the manufacturing industry is now seeing price increases and greatly extended lead times. It seems the situation is likely to get rapidly worse rather than better. What can we do? Read on.