RTW NEPCON South China: Rehm on Machine Communications and Vacuum Technology in Reflow


Reading time ( words)

Ralf Wagenfuehr, plant manager at Rehm Thermal Systems, speaks with I-Connect007 Managing Editor Stephen Las Marias during the recent NEPCON South China event in Shenzhen about the need for a common communications platform or interface as the industry moves toward Industry 4.0. He talks about how their new ViCON software can help manufacturers achieve the smart factory vision.

Wagenfuehr also discusses how vacuum technology helps eliminate voiding in reflow soldering.

Watch the Interview Here

Share

Print


Suggested Items

RTW NEPCON South China: Rehm Sees Growing Demand for Vacuum Soldering

09/28/2018 | Real Time With... NEPCON South China
Ralf Wagenfuehr, plant manager of Rehm Thermal Systems (Dongguan) Ltd, speaks with I-Connect007’s Edy Yu about the developments in the company’s convection reflow soldering system, which features a vacuum module, aimed at addressing the increasing demand for vacuum soldering. He also discusses their software developments, as well as how they are helping their customers toward their Industry 4.0 journey.

Reflow Perspectives to Flex Circuit Assemblies

07/13/2018 | Stephen Las Marias, I-Connect007
At the recent NEPCON China 2018 event in Shanghai, I spoke with Ralf Wagenfuehr, plant manager at Rehm Thermal Systems, to gain insight into flex circuit assembly, and the challenges of reflow soldering. He also speaks about the need for industry forums focused on soldering flex printed circuits.

RTW NEPCON CHINA: Rehm Discusses Reflow Strategies to Reduce Voiding

05/10/2018 | Real Time with... NEPCON China
At the recent NEPCON China 2018 event in Shanghai, Ralf Wagenfuehr, plant manager at Rehm Thermal Systems in China, speaks with I-Connect007’s Stephen Las Marias about their latest advancements in reflow oven technology, as well as on strategies to reduce voiding.



Copyright © 2019 I-Connect007. All rights reserved.