LED A.R.T. Symposium Program Announced


Reading time ( words)

CALCE and SMTA have announced the program for the LED Assembly, Reliability & Testing Symposium held at the Archie K. Davis Conference Center in Research Triangle Park, North Carolina from November 28–30, 2017.

The technical program on November 28 and 29 features presentations on topics including LED applications, packaging, failure mechanisms, LED solder joint reliability, and board processing with LEDs. Plus there is a keynote presentation by Ralph Tuttle from Cree.

Three workshops are offered Thursday, November 30. Ning-Cheng Lee, Ph.D., Indium Corporation, will instruct an all-day course on DFX for Advanced Soldering Technology. Martine Simard-Normandin, Ph.D., MuAnalysis Inc., will instruct a half-day course on Shining a Light on LED Technology: Construction, Reliability, Qualification, Failure Mode. Diganta Das, Ph.D., CALCE, University of Maryland, will instruct a half-day course on Failure Mechanisms and Qualification Tests for LEDs.

The early registration deadline is November 7, 2017. 

About SMTA - A Global Association Working at a Local Level

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. For more information or to register here.

About CALCE

CALCE the largest electronic products and systems research center focused on electronics reliability, is dedicated to providing a knowledge and resource base to support the development of competitive electronic components, products and systems.

Share


Suggested Items

Conversation with Miraco… Strategies for Successful Flex Circuit Assembly

07/11/2018 | Stephen Las Marias, I-Connect007
Jason Michaud, a 19-year veteran at Miraco Inc., is the company’s new vice president of sales. In an interview with SMT007 Magazine, Jason speaks about the factors driving the increasing utilization of flexible printed circuits, the challenges in flex circuit assembly, and the best practices to address those issues.

West Penn SMTA: New Leadership, Same Commitment

06/28/2018 | Patty Goldman, I-Connect007
SMTA's new chapter president, Jason Emes, a quality engineer with Pennatronics Corporation enthusiastically discussed with I-Connect007's Patty Goldman the latest goings-on with this Keystone State chapter. He also spoke about his plans and initiatives for the SMTA West Penn Chapter.

Jigar Patel on ZESTRON’s Reliability Solutions for Class 3 Assemblies

06/14/2018 | Patty Goldman, I-Connect007
At the SMTA West Penn Expo, I had a chance to discuss a paper presented by Jigar Patel, senior application engineer at ZESTRON. Jigar explained some of the cleaning challenges with newer components and how ZESTRON helps optimize cleaning processes for their customers.



Copyright © 2018 I-Connect007. All rights reserved.