Dr. Jennie Hwang to Present on Package/Board Level Integrity & Solder Joint Reliability at IMAPS 2017


Reading time ( words)

Industry expert Dr. Jennie S. Hwang will leverage her decades of extensive real-world experiences and deep knowledge to present on package and board level integrity, as well as solder joint reliability, at the upcoming IMAPS 2017 symposium, to be held from October 9–12, 2017 in Raleigh, North Carolina.

With the goal to produce reliable products while achieving high yield production, this short course provides a holistic overview of product reliability and of critical players of the package/board level integrity and solder joint reliability, including the roles of materials, processes and testing/service conditions, as well as the crucial principles behind the product reliability. Recent developments related to lead-free solder materials and the prevention of PCB laminates issues, tin whisker and intermetallics-related concerns in relation to manufacturability and reliability will be outlined.

The short course emphasizes on practical, working knowledge, yet balanced and substantiated by science. Interactions are encouraged, and attendees are welcome to bring their own selected systems for deliberation.

For more information or to register, click here.

Share

Print


Suggested Items

Solder Paste Printing From the Stencil’s Perspective

02/19/2020 | I-Connect007 Editorial Team
Jeff Schake of ASM Assembly Systems discusses the complications surrounding printing and solder paste that he sees from his perspective as a stencil expert.

Blackfox Trains Veterans for Good Manufacturing Jobs

02/18/2020 | Real Time with...IPC
Blackfox Training Institute has been training manufacturing technologists for over 20 years. Based in Longmont, Colorado, Blackfox is now focused on helping veterans of our armed services transition into good jobs in the manufacturing sector. During IPC APEX EXPO 2020, Editor Nolan Johnson spoke with Blackfox CEO Al Dill about the company's veteran training programs, and how this effort is helping companies fill jobs that might otherwise go unfilled.

Solder in PCBA: Can’t Live Without It... or Can We?

02/17/2020 | Joe Fjelstad, Verdant Electronics
For most of its historical use in electronics, the solder alloy of choice was tin-lead, either an Sn60/Pb40 alloy or the Sn63/ Pb37 eutectic version of the tin-lead alloy. These two alloys were the workhorses of the industry. They were both well understood in terms of their processing and reliability—that is, until the advent of lead-free, a well-meaning but ill-conceived and poorly executed conversion, forced on the industry by the European Union in 2006.



Copyright © 2020 I-Connect007. All rights reserved.