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Industry expert Dr. Jennie S. Hwang will leverage her decades of extensive real-world experiences and deep knowledge to present on package and board level integrity, as well as solder joint reliability, at the upcoming IMAPS 2017 symposium, to be held from October 9–12, 2017 in Raleigh, North Carolina.
With the goal to produce reliable products while achieving high yield production, this short course provides a holistic overview of product reliability and of critical players of the package/board level integrity and solder joint reliability, including the roles of materials, processes and testing/service conditions, as well as the crucial principles behind the product reliability. Recent developments related to lead-free solder materials and the prevention of PCB laminates issues, tin whisker and intermetallics-related concerns in relation to manufacturability and reliability will be outlined.
The short course emphasizes on practical, working knowledge, yet balanced and substantiated by science. Interactions are encouraged, and attendees are welcome to bring their own selected systems for deliberation.
For more information or to register, click here.
Whether in production, or repair and rework, the cost of soldering iron tips can be easily overlooked, but with today’s requirement for higher temperatures in lead-free solder applications, the consumption of tips has dramatically increased. This fact, combined with changes in tip design to meet the higher thermal load requirements, has also resulted in escalating tip costs, making tip care a high priority.
Russell Poppe, JJS Manufacturing
Much has been written about the increasing shortages of electronic components such as MLCCs, chip resistors and other semiconductor devices. And the manufacturing industry is now seeing price increases and greatly extended lead times. It seems the situation is likely to get rapidly worse rather than better. What can we do? Read on.
Real Time With... NEPCON South China
At the recent NEPCON South China 2018 event in Shenzhen, Clemens Jargon, VP for Global Dispensing and Asia at Mycronic, discusses I-Connect007's Edy Yu the challenges that customers face on their journey towards Industry 4.0, and how Mycronic is addressing these issues. From jet printing to solder paste inspection, to pick-and-place, Jargon talks about their total solutions that aim to help customers take their production to the next level.