Alpha to Continue Focus on Void Reduction & Low Temperature Solutions at SMTA in Guadalajara, Mexico


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Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will be exhibiting and giving a featured presentation at the 2017 SMTA Mexico Conference and Exhibition on October 18 – 19 at the Hotel Riu Plaza, Guadalajara, Mexico. 

At the show, Alpha will feature its latest void reduction and low temperature assembly process technology solutions.  Two products to be highlighted during the show as part of these solutions are the innovative void reduction ALPHA AccuFlux BTC-578 Preform System and a new low temperature solder paste, ALPHA OM-550.

“Alpha has developed a reliable low void technology system for bottom terminated components.“ Said Jerry Sidone, Product Manager for Engineered Materials at Alpha Assembly Solutions. “The ALPHA® AccuFlux™ BTC-578 Preform System has been specially designed to dramatically decrease voiding, an issue of increasing importance as power densities continue to rise and managing thermal reliability becomes more of a challenge.“

Alpha recently launched its new ALPHA® OM-550 low temperature solder paste.  “We are very excited about the performance of OM-550.  It is a low temperature solution for customers looking for SAC305-type mechanical and thermal reliability in a low temperature alloy,“ said Robert Wallace, Regional Marketing Manager for the Americas. “This paste provides customers with efficiencies in both energy and cost while improving BGA mechanical reliability compared to other low temp alloys.“In addition, Alpha will deliver one of the featured presentations during the conference.  Mitch Holtzer, Director of Alpha’s Reclaim Business, will be presenting, “The Effect of Solder Paste Reflow Conditions on Surface Insulation Resistance“ on Wednesday. October 18, Salon B.

About SMTA

The Surface Mount Technology Association (SMTA) is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations. For more information, click here.

About Alpha Assembly Solutions

Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others. With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA® electronics assembly material products, including Solder Paste, Exactalloy® Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils.  It offers die attach product technologies to the power electronics segment in its Argomax, Atrox and Fortibond brands.

For the LED segment, Alpha offers its Lumet products covering applications from die attach to systems assembly in the LED manufacturing process.  Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications. 

Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials.  For more information, click here.

 

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