Visit the Solder Recovery Experts at SMTA Guadalajara


Reading time ( words)

EVS International has announced plans to exhibit in Booth #65 at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place October 18-19, 2017 at the Hotel Riu Guadalajara. EVS will show the EVS 500LF Solder Recovery System. With the new concept of improved performance plus the significant reduction in price, everyone can enjoy the savings that EVS solder recovery systems can offer.

With the EVS500LF, users can quickly recover up to 80 percent of pure solder with a higher ROI from the waste dross. EVS has continually improved the performance of the EVS units and the new EVS 500LF is no exception.

The EVS 500LF has the same footprint as a printer and is aimed at multiple markets: The customer with one lead wave and one lead-free wave; the customer who uses Nitrogen or wants to reduce their Nitrogen usage; the customer with selective solder pots who only removes small amounts of dross every hour; or the customer with multiple waves where one EVS 500LF is connected to each wave.

For more information about EVS International’s industry-leading systems, click here.

Share


Suggested Items

Tips to Improve Soldering Tip Life and Reduce Cost

10/10/2018 | Thermaltronics
Whether in production, or repair and rework, the cost of soldering iron tips can be easily overlooked, but with today’s requirement for higher temperatures in lead-free solder applications, the consumption of tips has dramatically increased. This fact, combined with changes in tip design to meet the higher thermal load requirements, has also resulted in escalating tip costs, making tip care a high priority.

What SMT Component Shortages Mean for Design and Manufacturing Engineers

09/13/2018 | Russell Poppe, JJS Manufacturing
Much has been written about the increasing shortages of electronic components such as MLCCs, chip resistors and other semiconductor devices. And the manufacturing industry is now seeing price increases and greatly extended lead times. It seems the situation is likely to get rapidly worse rather than better. What can we do? Read on.

RTW NEPCON South China: Mycronic Discusses Industry 4.0

09/12/2018 | Real Time With... NEPCON South China
At the recent NEPCON South China 2018 event in Shenzhen, Clemens Jargon, VP for Global Dispensing and Asia at Mycronic, discusses I-Connect007's Edy Yu the challenges that customers face on their journey towards Industry 4.0, and how Mycronic is addressing these issues. From jet printing to solder paste inspection, to pick-and-place, Jargon talks about their total solutions that aim to help customers take their production to the next level.



Copyright © 2018 I-Connect007. All rights reserved.