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EVS International has announced plans to exhibit in Booth #65 at the SMTA Guadalajara Expo & Tech Forum, scheduled to take place October 18-19, 2017 at the Hotel Riu Guadalajara. EVS will show the EVS 500LF Solder Recovery System. With the new concept of improved performance plus the significant reduction in price, everyone can enjoy the savings that EVS solder recovery systems can offer.
With the EVS500LF, users can quickly recover up to 80 percent of pure solder with a higher ROI from the waste dross. EVS has continually improved the performance of the EVS units and the new EVS 500LF is no exception.
The EVS 500LF has the same footprint as a printer and is aimed at multiple markets: The customer with one lead wave and one lead-free wave; the customer who uses Nitrogen or wants to reduce their Nitrogen usage; the customer with selective solder pots who only removes small amounts of dross every hour; or the customer with multiple waves where one EVS 500LF is connected to each wave.
For more information about EVS International’s industry-leading systems, click here.
Reza Ghaffarian, Jet Propulsion Laboratory, California Institute of Technology
Electroless nickel/electroless palladium/immersion gold (ENEPIG) surface finish for PCBs has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. This article presents the reliability of LGA component packages with 1156 pads assembled with tin-lead solder onto PCBs with an ENEPIG finish and then subjected to thermal cycling and then isothermal aging.
Duane Benson, Screaming Circuits
There are two primary types of causes of board warping: process related at the fab or assembly shop, and layout related issues. If it's warped before assembly, it's between fab and layout. If it's flat before assembly and warped after, it's most likely between layout and assembly. That said, sometimes a fab problem won't show up until a pass through the reflow oven at your assembly partner.
Glen Thomas, Ph.D., and Bill Cardoso, Ph.D., Creative Electron Inc.
As aerospace companies consider the shift to lead-free solder alloys and glues, concerns have been raised about whether their current X-ray inspection and quality-control procedures will still be valid. With lead solder, joints are easily interpreted by the operator or the system imaging software because lead provides excellent image contrasts due to relatively high X-ray absorption compared to that of PCB and component materials. Will this hold true as they shift to lead-free solder compounds?