BTU to Exhibit Reflow Ovens and Custom Furnaces at IMAPS Raleigh


Reading time ( words)

BTU International Inc. will showcase its PYRAMAX reflow ovens and high-temperature belt furnaces at IMAPS Raleigh, scheduled to take place October 10–12, 2017 at the Raleigh Convention Center in North Carolina. BTU will be in Booth 311.

IMAPS seeks to advance industry collaboration in microelectronics packaging and assembly. BTU has been involved with IMAPS for many decades as a leader in thermal processing for advanced packaging processes including solder reflow, die attach, thick film, Direct Bond Copper (DBC), lid sealing and glass-to-metal sealing processes.

PYRAMAX convection reflow ovens are known for their precision and tight regulation. The exclusive closed-loop convection technology consistently delivers the three things that create unmatched performance: thermal uniformity, atmosphere purity and very low exit temperatures. Highly controlled convection rates result in the same thermal process, line-to-line, factory-to-factory and site-to-site, on a global scale.

Proudly manufactured in America for more than six decades, BTU custom furnaces deliver peak performance and long-term reliability. BTU’s family of precision-controlled, high-temperature belt furnaces surpass even the most challenging requirements of high-volume thermal processing, with astounding control of atmosphere, down to 2ppm O2 in the process zones. This, combined with cross-belt uniformity exceeding ±2°C, delivers amazing throughput and cycle time, without process yield loss over batch processes.

About BTU International

BTU International, a wholly-owned subsidiary of Amtech Group (Nasdaq: ASYS), is a global supplier and technology leader of advanced thermal processing equipment in the electronics manufacturing market. BTU’s high-performance reflow ovens are used in the production of SMT printed circuit board assemblies and in semiconductor packaging processes. BTU also specializes in precision controlled, high-temperature belt furnaces for a wide range of custom applications, such as brazing, direct bond copper (DBC), diffusion, sintering and advanced solar cell processing. BTU has operations in North Billerica, Massachusetts, and Shanghai, China, with direct sales and service in the U.S.A., Asia and Europe. Information about BTU International is available here.

Share


Suggested Items

Solder Printing Process Inputs Impacting Distribution of Paste Volume

12/14/2017 | Marco Lajoie and Alain Breton, C-MAC Microelectronics
The volume of solder deposition, like any process, has variations that may be characterized by a statistical distribution curve, whether normal or non-normal. As complexity, density, cost and reliability requirements increase, there may be value in narrowing the distribution curve. It is common sense that less variation serves the interest of quality of the more complex and dense circuit boards.

Improving Solder Paste Printing

12/12/2017 | Stephen Las Marias, I-Connect007
Of the three elements involved in the solder paste printing process—stencil, solder paste, and printer—the stencil is considered one of the major factors affecting the transfer efficiency, accuracy, and consistency, of solder pastes into the pads, especially with the continuing trend towards miniaturization.

Equipment Matters in Solder Paste Printing

12/06/2017 | Stephen Las Marias, I-Connect007
The solder paste printing process has always been considered a major contributor to yield loss. According to many studies, solder paste printing accounts for up to 70% of all PCB assembly defects. For the December issue of SMT Magazine, we interviewed experts in the solder paste printing process to learn more about the key issues leading to this huge percentage of defects, and the technology developments that are addressing these challenges and improving yields in the process.



Copyright © 2017 I-Connect007. All rights reserved.