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SHENMAO Technology Inc.'s new generation ultra-low residue SMF-WB51 liquid flux, featuring superior spray uniformity, excellent soldering performance and a wide process window for chip scale and fan out wafer level packaging, will be showcased at the upcoming International Wafer Level Packaging Conference (IWLPC) 2017 in San Jose, California. SHENMAO will be in Booth 12.
In addition, the company will also feature its PF606-P140 lead-free solder paste and PF606-P245 zero-halogen, lead-free solder paste, which offers a wide process window, superior print and solderability to solve head on pillow issues and improve ICT testability.
Happy Holden, I-Connect007
Dr. Traian Cucu, group leader of the Global Applications and Technologies Expert Group (GATE)—R&D—within Alpha Assembly Solutions, speaks with I-Connect007 Technical Editor Happy Holden about low-temperature and lead-free soldering applications, and the many critical advantages that can achieved by moving to a low-temperature process. They talk about the industry's transition to lead-free, the first, second and third generation of adoption of low-temperature alloys.
Nolan Johnson, I-Connect007
Based in San Francisco, Tempo Automation specializes in rapid PCB assembly and on low volume production for a wide range of board complexities. It recently held an open house at its brand-new facility in the South of Market (SoMa) district—which is normally restricted under customer non-disclosure agreements as well as International Traffic in Arms Regulations (ITAR) regulations—to customers, vendors, local designers, and government officials.
Real Time with...SMTAI
At SMTA International 2018, Dan Walker, North American sales manager at Inventec Performance Chemicals USA, provides Editor Nolan Johnson an overview and update on Inventec’s environment-friendly cleaning, soldering and coatings products. He also discusses how they are addressing the latest manufacturing issues, including solder voiding.