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SHENMAO Technology Inc.'s new generation ultra-low residue SMF-WB51 liquid flux, featuring superior spray uniformity, excellent soldering performance and a wide process window for chip scale and fan out wafer level packaging, will be showcased at the upcoming International Wafer Level Packaging Conference (IWLPC) 2017 in San Jose, California. SHENMAO will be in Booth 12.
In addition, the company will also feature its PF606-P140 lead-free solder paste and PF606-P245 zero-halogen, lead-free solder paste, which offers a wide process window, superior print and solderability to solve head on pillow issues and improve ICT testability.
Stephen Las Marias, I-Connect007
Tom Forsythe, executive vice president at KYZEN, discusses the most critical challenges of the cleaning process, a new approach to testing the cleanliness of PCB assemblies, and how KYZEN is helping customers develop a more data-driven approach to cleaning.
Jason Fullerton, Alpha Assembly Solutions
This paper investigates and compares the performance of no-clean liquid wave soldering fluxes using a commercially available localized extraction and cleanliness testing system, and surface insulation resistance (SIR) testing. Find out which test is suitable for your processes.
Patty Goldman, I-Connect007
I-Connect007 Editor Patty Goldman interviews one of Alpha Assembly Solution’s solder process experts, Traian Cucu, who is based at Alpha’s R&D center in New Jersey. Traian, along with Morgana Ribas, have played key roles in the development of Alpha’s innovation new low-temperature solder paste process. He also talks about how this solves many of the defects issues that one would see on a SAC assembly process.