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SHENMAO Technology Inc.'s new generation ultra-low residue SMF-WB51 liquid flux, featuring superior spray uniformity, excellent soldering performance and a wide process window for chip scale and fan out wafer level packaging, will be showcased at the upcoming International Wafer Level Packaging Conference (IWLPC) 2017 in San Jose, California. SHENMAO will be in Booth 12.
In addition, the company will also feature its PF606-P140 lead-free solder paste and PF606-P245 zero-halogen, lead-free solder paste, which offers a wide process window, superior print and solderability to solve head on pillow issues and improve ICT testability.
Patty Goldman, I-Connect007
At the SMTA West Penn Expo, I had a chance to discuss a paper presented by Jigar Patel, senior application engineer at ZESTRON. Jigar explained some of the cleaning challenges with newer components and how ZESTRON helps optimize cleaning processes for their customers.
Dora Yang, PCBCart
As a cutting-edge technology applied in SMT assembly, BGA packages have quickly become a significant selection to conform to fine pitch and ultrafine pitch technology, achieving high-density interconnection with a reliable assembly technology provided, which leads to the increasingly more applications of this type of package.
Real Time with... NEPCON China
At the recent NEPCON China 2018, Klaus Schubert, managing director of Armada, speaks about the increasing electrification in cars and how this is impacting the PCB assembly processes, and in particular, the solder paste printing.