SHENMAO to Exhibit Latest Solder Pastes and Fluxes at IWLPC 2017


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SHENMAO Technology Inc.'s new generation ultra-low residue SMF-WB51 liquid flux, featuring superior spray uniformity, excellent soldering performance and a wide process window for chip scale and fan out wafer level packaging, will be showcased at the upcoming International Wafer Level Packaging Conference (IWLPC) 2017 in San Jose, California. SHENMAO will be in Booth 12.

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In addition, the company will also feature its PF606-P140 lead-free solder paste and PF606-P245 zero-halogen, lead-free solder paste, which offers a wide process window, superior print and solderability to solve head on pillow issues and improve ICT testability.

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