Indium Experts to Present at productronica 2017


Reading time ( words)

Indium Corporation’s Andreas Karch, Regional Technical Manager, Germany, Austria and Switzerland, and Karthik Vijay, Technical Manager, Europe, Africa and the Middle East, will present at Productronica, November 14-17, in Munich, Germany.

Indium_experts.jpgIndium Corporation’s Karch and Vijay will present the following:

A Novel Solder Alloy for Service Temperatures of 150–175°C in Automotive Applications
- German presentation by Karch
Wednesday, November 15 at 5 p.m.
- English presentation by Vijay
Thursday, November 16 at 5 p.m.

Minimizing QFN Voiding During SMT Assembly
- German presentation by Karch
Tuesday, November 14 at 4 p.m.
- English presentation by Vijay
Wednesday, November 15 at 4 p.m.

Karch provides technical support for customers in Germany, Austria and Switzerland, sharing process knowledge and making technical recommendations for the use of Indium Corporation’s materials, such as solder paste, solder preforms, fluxes, and thermal management materials. Karch has more than 20 years of automotive industry experience, including the advanced development of customized electronics. He is an ECQA-certified integrated design engineer and has a Six Sigma Yellow Belt. The Austrian Patent Office also selected him as one of the 2014 recipients of the Top 10 Inventum Awards for an automotive LED assembly. Karch maintains a thorough understanding of process technologies and project management skills.

Vijay is based in the UK and manages Indium Corporation’s technology programs and technical support throughout Europe. His expertise is focused on solder paste, engineered solders, thermal interface materials, and semiconductor-grade electronics assembly materials. Karthik is active in several industry organizations, including IMAPS and the Surface Mount Technology Association (SMTA), and has presented at industry forums and conferences internationally. He earned his master’s degree in systems science and industrial engineering from Binghamton University, State University of New York.

About Indium Corporation

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil. Founded in 1934, Indium has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

For more information about Indium Corporation, click here.

Share


Suggested Items

Improving Solder Paste Printing

12/12/2017 | Stephen Las Marias, I-Connect007
Of the three elements involved in the solder paste printing process—stencil, solder paste, and printer—the stencil is considered one of the major factors affecting the transfer efficiency, accuracy, and consistency, of solder pastes into the pads, especially with the continuing trend towards miniaturization.

Equipment Matters in Solder Paste Printing

12/06/2017 | Stephen Las Marias, I-Connect007
The solder paste printing process has always been considered a major contributor to yield loss. According to many studies, solder paste printing accounts for up to 70% of all PCB assembly defects. For the December issue of SMT Magazine, we interviewed experts in the solder paste printing process to learn more about the key issues leading to this huge percentage of defects, and the technology developments that are addressing these challenges and improving yields in the process.

What Matters Most is Communication

12/04/2017 | Stephen Las Marias, I-Connect007
While there may be new techniques and strategies, technologies, equipment, tools, and materials to employ and utilize, there is always one thing that will ensure the manufacturing/ assembly success of your product: communication. Communication between the designer and the assembler will help improve the manufacturability and assembly of the final product—even before the board design gets fabricated.



Copyright © 2017 I-Connect007. All rights reserved.