ECD to Display Complete Range of Thermal Profiling and Verification Solutions at productronica


Reading time ( words)

At this year's productronica event in Munich, Germany, ECD will showcase its award-winning thermal profiling technologies, including the broad portfolio of M.O.L.E. thermal profilers, wave soldering test pallets and reflow oven performance verification tools. In addition, the company plans to debut a next-generation, scalable monitoring system designed to provide continuous oversight and customizable data analysis for various SMT thermal processes. The first module centers on reflow oven performance and output optimization. ECD will be in Hall A4 Booth 532.

ECD's M.O.L.E. thermal profiling range includes 3-, 6- and 20- channel options to address the various requirements of standard SMT through to complex, high-value assemblies. Visitors to the ECD booth can learn more about its MEGA M.O.L.E. 20 profiler for demanding, high-complexity boards and R&D work; the SuperM.O.L.E. Gold 2 with six channels of powerful profiling capability ideal for OEMs and EMS providers that need reliable performance and versatility; and, the V-M.O.L.E., which provides value and verification in an easy-to-use three-channel system. The profiling portfolio will be demonstrated alongside ECD’s process test pallets, including the WaveRIDER, OvenRIDER NL 2+, OvenCHECKER® and Fluxometer.    

"M.O.L.E. is the industry's original thermal profiling system, developed by ECD over three decades ago when we were the first to recognize the technology need," says ECD President and CEO, Todd Clifton. "Since then, our expert team has continued M.O.L.E.’s engineering evolution, always progressing and perfecting our approach to thermal process optimization. We invite Productronica show delegates to learn more about what M.O.L.E. and our thermal process experts can do to enhance their soldering operation."

The company's long, successful history and expansive thermal processing know-how is at the foundation of ECD's latest innovation, a breakthrough continuous process monitoring system set to be introduced at productronica this year. Bypassing current market solutions, ECD's monitoring technology adds new levels of control, customization, scalability, trend identification and in-process product visibility for high-yield, cost-effective results. The company will introduce the first module for reflow oven monitoring.

"ECD continues to lead the market with meaningful technology innovation – delivering products that help reduce cost, raise productivity and improve yield," says Clifton in summary. "Our latest development underscores this approach and we look forward to demonstrating its effectiveness for productronica visitors."

Except as otherwise noted, all marks used herewith are trademarks and/or registered trademarks of ECD and/or its affiliates in the US and elsewhere.

About ECD

Founded in 1964, ECD is recognized worldwide for its leadership and expertise in thermal monitoring and analysis technology and, more recently, for its development of intelligent dry storage systems. Based in Milwaukie, Oregon, the company is a pioneer in the design, development, and manufacture of advanced intransit thermal profiling systems and software used to monitor and analyze process temperatures in various industries including electronics, solar and baking, among others. Well-known for its data-rich software expertise and robust hardware functionality, ECD leads the industry for innovative measurement and safeguarding systems.  

For more information about ECD, visit the company’s website here.

Share


Suggested Items

Mycronic Announces the Acquisition of Vi TECHNOLOGY

02/21/2018 | Barry Matties, I-Connect007
Mycronic recently announced the acquisition of Vi TECHNOLOGY, with the intent of combining VIT’s inspection technology with Mycronic’s jetting capabilities. In an interview with I-Connect007, Olivier Pirou, Managing Director of VIT, discusses more about the merger and how this will help VIT contend in such a competitive environment.

Improving Design, Manufacturing and Assembly Teamwork

01/15/2018 | Syrma Technology
Many electronics manufacturers tend to compartmentalize or "silo" their departments, such as the design team versus assembly-related functions. The relationship between design and manufacturing can too often be disconnected or otherwise poor, which stalls productivity and increases bottom-line costs. By identifying and addressing these gaps, this financial hemorrhage can be reduced, and profitability increased.

Recent Innovations in DFMA

01/10/2018 | Syrma Technology
Software, electronics and sensors are making their way into the world of product design. New composites, plastics and alloys are replacing traditional metals. Designs are even reducing the carbon footprint of manufacturers, and more products can be recycled when they reach the end of their use.



Copyright © 2018 I-Connect007. All rights reserved.