Alpha to Present on Lead-Free Soldering to the cSi Cell Stringing Process at Intersolar India


Reading time ( words)

Alpha Assembly Solutions is participating in the upcoming Intersolar India taking place December 5-7 in Mumbai, India, where global experts focus on photovoltaics, PV production technologies, energy storage systems and solar thermal technologies.

Narahari Pujari, R&D Manager for Alpha Assembly Solutions, part of the MacDermid Performance Solutions group of businesses, will present a technical paper on Lead-Free Soldering to the cSi Cell Stringing Process that focuses on PV market, current trends in the development of lead-free solutions and the impact on manufacturing costs by transitioning away from lead-based solder alloys, which are currently in use predominantly due to their sufficiently low melting points and ability to make reliable solder joints.

"Lead-containing alloys are not only toxic, but can result in hazardous waste classification for PV modules at the end of shelf-life, thus increasing costs overall when safe disposal efforts are included," said Pujari. "In order for the market to embrace the adaptation of lead-free alloys, we must first discuss the market drivers and understand the technological and manufacturing challenges involved with such a migration."

Various available technologies are critically assessed in Pujari's technical presentation which finds that although there is currently no data on long-term reliability of PV modules using lead-free alloys, there is sufficient evidence that supports its likelihood.  Additionally, lead-free solders for PV ribbon are proving to be cost and energy-efficient.

2017 Intersolar India
Date: Tuesday 5th December, 2017 – Thursday 7th December 2017
Venue: Mumbai, India

Presentation: Lead-Free Soldering to the cSi Cell Stringing Process
Date: 6th December 2017
Time: 10:55 am
Presented by: Narahari Pujari, R&D Manager, Alpha Assembly Solutions

About Alpha Assembly Solutions

Alpha Assembly Solutions, a MacDermid Performance Solutions Business, is the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, die attach, LED lighting, photovoltaics, semiconductor packaging, automotive and others.

With a unique global presence in over 30 locations throughout the Asia Pacific, Americas and Europe regions, Alpha supplies a full line of ALPHA electronics assembly material products, including Solder Paste, Exactalloy Solder Preforms, Cored Solder Wire Solder, Wave Soldering Fluxes, Bar Solder Alloys, and Stencils.  It offers die attach product technologies to the power electronics segment in its Argomax, Atrox and Fortibond brands.

For the LED segment, Alpha offers its Lumet products covering applications from die attach to systems assembly in the LED manufacturing process.  Alpha also offers product technologies for the Photovoltaic segment, including high performance liquid fluxes and solder alloys for producing standard ribbon and bus bar, as well as, solder pastes, cored wire, conductive adhesives and preforms for use in PV module assembly. Also, Alpha’s Advanced Materials unit is the leader in electronic polymers and solder materials for semiconductor packaging applications. 

Since its founding in 1872, Alpha has been committed to developing and manufacturing the highest quality specialty materials.  For more information, click here.

Share


Suggested Items

Jigar Patel on ZESTRON’s Reliability Solutions for Class 3 Assemblies

06/14/2018 | Patty Goldman, I-Connect007
At the SMTA West Penn Expo, I had a chance to discuss a paper presented by Jigar Patel, senior application engineer at ZESTRON. Jigar explained some of the cleaning challenges with newer components and how ZESTRON helps optimize cleaning processes for their customers.

Elements to Consider on BGA Assembly Process Capability

06/05/2018 | Dora Yang, PCBCart
As a cutting-edge technology applied in SMT assembly, BGA packages have quickly become a significant selection to conform to fine pitch and ultrafine pitch technology, achieving high-density interconnection with a reliable assembly technology provided, which leads to the increasingly more applications of this type of package.

RTW NEPCON China: Armada Discusses Impact of Auto Electrification on PCB Assembly

06/01/2018 | Real Time with... NEPCON China
At the recent NEPCON China 2018, Klaus Schubert, managing director of Armada, speaks about the increasing electrification in cars and how this is impacting the PCB assembly processes, and in particular, the solder paste printing.



Copyright © 2018 I-Connect007. All rights reserved.