-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
Dow Highlights Silicone Solutions for Advanced PCB Assembly at productronica 2017
November 20, 2017 | Dow Performance SiliconesEstimated reading time: 2 minutes
At productronica 2017, Dow Performance Silicones, a global business unit of DowDuPont’s Materials Science Division, featured new, proven and upcoming silicone solutions alike under its newly announced DOWSIL brand. Highlights included an early glimpse of a major upcoming product launch; the unveiling and demonstration of a new fast-curing, low-temperature adhesive; and other recent innovations from the company’s broad portfolio of silicone and thermal management solutions for demanding PCB assembly applications.
"Silicone technology has entered a new era of innovation with the launch of the DOWSIL product brand," said Rogier Reinders for Dow. "Replacing the legacy Dow Corning label, the new DOWSIL name represents the combined power of Dow and Dow Corning to push the boundaries of both customer service and material science to pioneer groundbreaking new solutions in the development of advanced materials for PCB and LED assembly."
Dow offered a glimpse of that future during productronica with an exclusive sneak peek of a soon-to-be-launched solvent-free conformal coating that delivers very low viscosity, high hardness and a growing list of external validations for use in demanding PCB assembly applications.
Another highlight at the booth was the DOWSIL EA-6060 Adhesive, which is among the first products to be launched under the new DOWSIL brand. This advanced new silicone bonds quickly at low temperatures to support faster, lower-cost production of electronic modules. DOWSIL EA-6060 Adhesive was also part of a live equipment demonstration, where Scheugenpflug AG, a supplier of adhesive bonding, dispensing and potting technology, dispensed the material live on its CNCell equipped with a Dos GP gear pump dispenser.
Additional innovations displayed at Dow’s booth included the following:
- recently launched DOWSIL EA-5151 Quick-in-Connect (QiC) adhesive, a one-part silicone formulation that delivers fast green strength at room temperature for faster cycle times;
- DOWSIL EG-3810 and EG-3896 Dielectric Gels, designed to withstand higher junction temperatures within IGBT and other power electronics modules, enabling allow higher power densities and, in turn, more compact designs;
- thermally conductive silicones—including the new and exceptionally well-received silicone gap fillers—that deliver outstanding thermal stability to efficiently manage heat dissipation; and,
- conformal silicone coatings that deliver proven protection of printed circuit boards against dust, moisture, harsh chemicals, extreme cycling, and vibration.
About Dow Performance Silicones
Dow Performance Silicones, a business unit of the Dow Consumer Solutions Portfolio aligned to DowDuPont Materials Science, delivers a complete portfolio of silicone solutions and performance materials to serve the diverse needs of customers and industries around the world. From the transportation and pressure sensitive industries to high performance building solutions and chemical manufacturing, Dow’s Performance Silicones business helps our customers solve their most challenging problems. As a global leader in innovation and silicon-based technology, we are committed to bringing new solutions to the market that do more for our customers and continue to improve the lives of consumers worldwide. Visit dowcorning.com to learn more.
About DowDuPont Materials Science Division
DowDuPont Materials Science, a business division of DowDuPont (NYSE: DWDP), combines science and technology knowledge to develop premier materials science solutions that are essential to human progress. The division has one of the strongest and broadest toolkits in the industry, with robust technology, asset integration, scale and competitive capabilities that enable it to address complex global issues. DowDuPont Materials Science’s market-driven, industry-leading portfolio of advanced materials, industrial intermediates, and plastics businesses deliver a broad range of differentiated technology-based products and solutions for customers in high-growth markets such as packaging, infrastructure, and consumer care. DowDuPont intends to separate the Materials Science Division into an independent, publicly traded company. More information can be found at www.dow-dupont.com.
Suggested Items
Koh Young Showcases Award-winning Inspection Solutions at SMTconnect with SmartRep in Hall 4A.225
04/25/2024 | Koh Young TechnologyKoh Young Technology, the industry leader in True 3D measurement-based inspection solutions, will showcase an array of award-winning inspection and measurement solutions at SMTconnect alongside its sales partner, SmartRep, in booth 4A.225 at NürnbergMesse from June 11-13, 2023. The following offers a glimpse into what Koh Young will present at the tradeshow:
Real Time with… IPC APEX EXPO 2024: Plasmatreat: Innovative Surface Preparation Solutions
04/25/2024 | Real Time with...IPC APEX EXPOIn this interview, Editor Nolan Johnson speaks with Hardev Grewal, CEO and president of Plasmatreat, a developer of atmospheric plasma solutions. Plasmatreat uses clean compressed air and electricity to create plasma, offering environmentally friendly methods for surface preparation. Their technology measures plasma density for process optimization and can remove organic micro-contamination. Nolan and Hardev also discuss REDOX-Tool, a new technology for removing metal oxides.
Nanotechnology Market to Surpass $53.51 Billion by 2031
04/25/2024 | PRNewswireSkyQuest projects that the nanotechnology market will attain a value of USD 53.51 billion by 2031, with a CAGR of 36.4% over the forecast period (2024-2031).
Cadence, TSMC Collaborate on Wide-Ranging Innovations to Transform System and Semiconductor Design
04/25/2024 | Cadence Design SystemsCadence Design Systems, Inc. and TSMC have extended their longstanding collaboration by announcing a broad range of innovative technology advancements to accelerate design, including developments ranging from 3D-IC and advanced process nodes to design IP and photonics.
SMC Korea 2024 to Highlight Semiconductor Materials Trends and Innovations on Industry’s Path to $1 Trillion
04/24/2024 | SEMIWith Korea a major consumer of semiconductor materials and advanced materials a key driver of innovation on the industry’s path to $1 trillion, industry leaders and experts will gather at SMC (Strategic Materials Conference) Korea 2024 on May 29 at the Suwon Convention Center in Gyeonggi-do, South Korea to provide insights into the latest materials developments and trends. Registration is open.